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Texas Instruments THS3062DGN — Analog & Data Acquisition

THS3062DGN Current Feedback Op Amp, 7000V/µs Slew Rate

MPNTHS3062DGN
End of Life

Texas Instruments THS3062DGN, dual current-feedback op amp, 7000 V/µs slew rate, 300 MHz -3 dB bandwidth, 2.2 GHz GBP, 145 mA output, 10 V to 30 V supply, 8-HVSSOP exposed-pad package, -40°C to 85°C.

$16.29Ref. price · indicative, final on quote
Packaging8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

THS3062DGN specifications
ParameterValue
MountingSurface Mount
Amplifier typeCurrent Feedback
Voltage - input offset700 µV
Voltage - supply span30 V
Current - supply8.3mA
Current - input bias6 µA
Current - output (Channel)145 mA
Operating temperature-40°C ~ 85°C
-3db bandwidth300 MHz
Gain bandwidth product2.2 GHz
PackageTube
Slew rate7000V/µs
Case8-TSSOP, 8-MSOP (0.118\", 3.00mm Width) Exposed Pad
Number of circuits2

Product details

Its 7000 V/µs slew rate and 300 MHz -3 dB bandwidth target high-speed signal conditioning — think video distribution, pulse amplifiers, or high-frequency ADC drivers where settling time matters. The current-feedback topology means gain-bandwidth product is not a fixed limit; bandwidth stays wide across gain settings, but the feedback resistor value sets the compensation, so the datasheet's recommended values are the starting point, not a suggestion.

Package and thermal — the exposed pad is not optional

The 8-HVSSOP package (3.00 mm width, 0.118" pitch) has an exposed pad on the bottom. Without it, the part will overheat driving high-speed signals into low-impedance loads. The pad is also the ground return for the current-feedback loop; a poor thermal/ground connection invites oscillation. Mounting is surface mount; the supplier device package is 8-HVSSOP.

Frequently asked questions

What is the slew rate of THS3062DGN?

The slew rate is 7000 V/µs, which is the standout spec for this part — it drives fast pulse edges and wideband signals without slew-induced distortion.

Does THS3062DGN require an exposed pad heatsink?

Yes. The 8-HVSSOP package has an exposed pad that must be soldered to a PCB copper plane for thermal management and proper ground return. Without it, the part may overheat under high-speed, low-impedance loads.