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Texas Instruments THS3062DGN — Memory (DRAM / SRAM / Flash / EEPROM)

THS3062DGN - Texas Instruments

MPNTHS3062DGN
End of Life

IC OPAMP CFA 2 CIRCUIT 8HVSSOP

$16.29Ref. price · indicative, final on quote
Packaging8-TSSOP, 8-MSOP (0.118", 3.00mm Width) Exposed Pad
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

THS3062DGN Technical Specifications
ParameterValue
Mounting typeSurface Mount
Amplifier typeCurrent Feedback
Voltage - input offset700 µV
Voltage - supply span30 V
Current - supply8.3mA
Current - input bias6 µA
Current - output (Channel)145 mA
Operating temperature-40°C ~ 85°C
-3db bandwidth300 MHz
Gain bandwidth product2.2 GHz
PackageTube
Slew rate7000V/µs
Case8-TSSOP, 8-MSOP (0.118\", 3.00mm Width) Exposed Pad
Number of circuits2

Frequently asked questions

Where can I buy THS3062DGN and how much does it cost?

Sourcing buyers need real-time price and stock from distributors to fill BOM lines.

What are the exact pinout and package dimensions of THS3062DGN?

Design engineers must validate PCB footprint and ensure pin compatibility.

Is THS3062DGN obsolete or end-of-life?

Brokers and buyers need lifecycle status to avoid supply chain disruptions.

What is a suitable replacement or equivalent for THS3062DGN?

Cross-reference is critical when part is out of stock or obsolete.

What is the maximum supply voltage and current consumption of THS3062DGN?

Maintenance techs and design engineers verify operating conditions for replacement or new designs.

Does THS3062DGN require an exposed pad heatsink?

Thermal management affects reliability; package has exposed pad for heat dissipation.