42-ball DSBGA footprint and board integration
The TAS2563YBGT comes in a 42-XFBGA, DSBGA package measuring 2.96 x 2.5 mm (supplier device package 42-DSBGA). That 0.4 mm ball pitch demands a controlled impedance PCB stack-up and a solder mask defined pad — the small ball diameter means the solder joint's standoff height is set by the paste volume, not the ball itself. Surface-mount only — no socket option. The MSL rating (not stated in this record) should be verified against the reel label; a DSBGA of this density typically ships at MSL 3, so a bake cycle before reflow is expected if the floor life is exceeded.
6.1 W mono output and dual-supply rails
Rated 6.1 W continuous into a 4 Ω load from a single channel — that is the Class D efficiency advantage at work, keeping the DSBGA die temperature below the 85 °C ambient ceiling without a heatsink. The 1.62 V to 1.95 V core supply powers the digital logic; the 2.5 V to 5.5 V rail feeds the output stage. The headroom between the power supply and the load's peak demand sets the undistorted output swing. Mono output means this is a per-speaker device — a stereo design needs two instances, each with its own supply decoupling at the ball grid.