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Texas Instruments SN75LVDS83BZQLR — Interface & Transceivers

SN75LVDS83BZQLR LVDS Driver, FlatLink, 56-BGA, Obsolete

MPNSN75LVDS83BZQLR
Obsolete

Texas Instruments FlatLink™ LVDS Driver, SN75LVDS83BZQLR, 5/0 Drivers/Receivers, 3V ~ 3.6V Supply, -10°C ~ 70°C, 56-VFBGA Microstar Junior (7x4.5).

$5.1900Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

SN75LVDS83BZQLR specifications
ParameterValue
TypeDriver
SeriesFlatLink™
MountingSurface Mount
Supply voltage3V ~ 3.6V
ProtocolLVDS
Operating temperature-10°C~70°C
PackageTape & Reel (TR); Cut Tape (CT)
Case56-VFBGA
Number of drivers (Receivers)5/0

Product details

LVDS driver for flat-panel display links — what you need to know before sourcing

The Texas Instruments SN75LVDS83BZQLR is an LVDS driver from the FlatLink series, designed to serialize parallel RGB data into a low-voltage differential signal for flat-panel display interfaces. The part is packaged in a 56-VFBGA Microstar Junior (7x4.5 mm), intended for surface-mount assembly on space-constrained display driver boards.

Obsolete — read the PCN before you buy

The SN75LVDS83BZQLR carries an official lifecycle status of Obsolete. Any available units are from surplus or independent-distributor inventory, and date-code provenance matters — stock surfacing well after the last-time-buy date should be inspected for handling and storage integrity. If your BOM relies on this exact order code, securing a verified lot through a qualified independent source is the only path, and it should be quoted to order.

5 drivers, 0 receivers — what the channel count means for your display interface

The 5/0 driver/receiver count indicates a unidirectional serializer — it drives LVDS signals from a host to a display panel, but does not receive.

The operating temperature range is -10°C to 70°C, a commercial-grade window.

56-BGA Microstar Junior — footprint and rework notes

The small body and 0.5 mm or 0.65 mm ball pitch (typical for this form factor) mean the PCB pad design must match TI's land pattern exactly. For rework, a preheat profile that avoids thermal shock to the BGA is essential — MSL handling per the bag label, with a bake cycle if the floor-life has been exceeded.

Frequently asked questions

What is the datasheet for SN75LVDS83BZQLR?

Design engineers need to verify fit, pinout and electrical characteristics.

What is the price and availability of SN75LVDS83BZQLR?

Sourcing buyers need to fill BOM and check stock for procurement.

Is SN75LVDS83BZQLR obsolete and what is the replacement?

Buyers and techs need to know lifecycle status and find a substitute if discontinued.

What are the pinout and package details for SN75LVDS83BZQLR?

Maintenance techs replacing a failed unit need to confirm mechanical compatibility.

Where can I buy SN75LVDS83BZQLR?

Transactional buyers need a distributor source to complete purchase.

What is the equivalent cross reference for SN75LVDS83BZQLR?

Broker checking for alternative parts during obsolescence management.