LVDS transceiver for 155 Mbps point-to-point links
At 155 Mbps the SN75LVDS051DR delivers a per-channel throughput typical of OC-3 / STM-1 line rates, also common in high-speed serial backplanes and camera-link interfaces. The full-duplex architecture allows simultaneous transmit and receive on separate differential pairs, which halves the cable count compared to half-duplex schemes.
The SN65LVDS051 is pin-compatible and electrically similar, though the wider temperature grade may require a design review of the thermal environment.
16-SOIC footprint and layout considerations
The SN75LVDS051DR is supplied in a 16-pin SOIC package with a body width of 3.90 mm (0.154 inch). For 155 Mbps LVDS signals, keep differential pair trace lengths matched and maintain 100-ohm differential impedance. Decouple the supply pins with a 0.1 µF ceramic capacitor placed as close to the VCC pin as possible.