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Texas Instruments SN74LVC1G240YEAR — Interface & Transceivers

SN74LVC1G240YEAR Buffer, Inverting, 3-State, 1.65V-5.5V

MPNSN74LVC1G240YEAR
Obsolete

Texas Instruments 74LVC series, Buffer, Inverting, 1-Element, 1-Bit per Element, 3-State Output, 32mA, 1.65V to 5.5V, Surface Mount, 5-XFBGA/DSBGA, -40°C to 85°C.

$0.1900Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

SN74LVC1G240YEAR specifications
ParameterValue
Series74LVC
Logic typeBuffer, Inverting
Output type3-State
MountingSurface Mount
Supply voltage1.65V ~ 5.5V
Current - output high, low32mA, 32mA
Operating temperature-40°C~85°C(TA)
PackageTape & Reel (TR); Cut Tape (CT)
Case5-XFBGA, DSBGA
Number of elements1
Number of bits per element1

Product details

The SN74LVC1G240YEAR: The 3-state output allows bus-sharing applications. Output drive is 32mA for both high and low states.

For production programs still using this exact order code, the procurement strategy is to qualify a form-fit-function replacement or secure a last-time-buy quantity through independent distribution.

It allows the part to operate as a level shifter between low-voltage cores (1.8V) and legacy 5V peripherals, or as a simple inverting buffer in a 3.3V system. The wide range also means the same BOM line can be used across multiple voltage domains without changing the part number, simplifying procurement for multi-rail designs. The 32mA symmetric output drive is typical for the 74LVC family and provides enough current to drive a single LED, a relay coil through a transistor, or multiple CMOS inputs on a shared bus.

5-DSBGA package — the fit constraint

The 5-DSBGA (1.4x0.9 mm) package is an ultra-small wafer-level chip-scale package. It is the smallest footprint option for this function, which is an advantage for space-constrained designs like wearables, sensors, or compact modules. However, the tiny bump pitch and lack of visible leads make it difficult for hand-assembly, rework, or inspection. For prototyping or low-volume production, a larger-package alternative such as the SOT-23 or SC-70 variant of the same function is often preferred. The DSBGA package also requires careful PCB layout with micro-vias and a solder-mask-defined pad pattern.

Frequently asked questions

Is there an equivalent to SN74LVC1G240YEAR in a larger package?

Yes, the same function is available in larger packages such as SOT-23 and SC-70 under the base part number SN74LVC1G240. These are pin-compatible in function but have a different footprint, so a PCB layout change is required.