Single Schmitt-trigger buffer in a 5-bump DSBGA
The Schmitt-trigger input provides hysteresis, which cleans up slow or noisy input edges — useful for switch debounce, oscillator buffers, or interfacing with sensors that have slow rise times. The push-pull output delivers 32 mA source and sink, enough to drive a modest LED or a few CMOS gate inputs.
Obsolete — plan for a replacement
The SN74LVC1G17YEPR is listed as obsolete. That means TI has stopped production, and the only available stock is what distributors and independent suppliers hold. The base part number SN74LVC1G17 is still available in other packages (SOT-23, SC-70, etc.), but the 5-DSBGA (1.4x0.9 mm) footprint is unique — a direct drop-in replacement may not exist.
Package: 5-DSBGA (1.4x0.9 mm)
The YEPR suffix identifies the 5-bump DSBGA package measuring 1.4x0.9 mm. This is a wafer-level chip-scale package — no leads, just solder bumps on the bottom. It is the smallest footprint for this function, but it demands a controlled reflow profile and careful board layout. The bumps are not visible after soldering, so X-ray inspection is the only way to confirm joint quality. The mounting is surface mount, and the supplier device package is 5-DSBGA (1.4x0.9).