Single-buffer bus isolation in a 1.45-mm² footprint
The SN74LVC1G125DRYR: The 32 mA symmetrical drive (both high and low) is enough to fan out to four or five standard CMOS loads on a short trace, but the real value is the 3-state enable: pulling the output enable pin high puts the output into high-impedance, so multiple buffers can share a bus without contention. Packaged in a 6-UFDFN (also called 6-SON, body 1.45 mm × 1.0 mm), this is a board-space play — the 0.5 mm pitch and 0.55 mm seated height fit under a low-profile shield or on a dense interposer.
Active production, ROHS3 — no compliance cliff
Listed as Active with no NRND or EOL flag — the 74LVC1G125 die is a standard-cell workhorse that TI has no reason to retire soon. ROHS3 compliant (no exemptions expiring), so no REACH or RoHS recertification risk for the BOM. The base product number 74LVC1G125 spans multiple package options; the DRYR suffix (6-SON, tape-and-reel) is the high-volume reel variant, while the YZPR suffix (DSBGA, 0.4 mm pitch) is the same die in a wafer-level package for the tightest footprint.