Through-hole DIP package — still the right call for rugged backplanes
This part comes in an 8-pin DIP package (8-PDIP, 0.300" body width) with through-hole mounting. For a maintenance-access panel or a high-vibration environment where a connectorized module gets swapped in the field, the DIP package is mechanically more robust than a surface-mount SOIC. It also simplifies hand-rework during prototype builds or small-batch production. The 1/1 driver/receiver count matches the classic RS-485 node topology — one driver, one receiver per chip, with the half-duplex bus contention handled by the microcontroller's DE pin.
Active lifecycle — no last-time-buy clock ticking
The base product number 65HVD20 covers the family, and the 'P' suffix identifies the DIP package variant.