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Texas Instruments OPA569AIDWP — Memory (DRAM / SRAM / Flash / EEPROM)

Texas Instruments OPA569AIDWP Op-Amp, 2.4 A Output, 20-HSOIC

MPNOPA569AIDWP
End of Life

Texas Instruments OPA569AIDWP general-purpose op-amp, single circuit, 2.4 A output per channel, 1.2 MHz GBW, 1.2 V/µs slew rate, rail-to-rail output, 20-HSOIC exposed pad package, tube.

$11.43Ref. price · indicative, final on quote
Packaging20-SOIC (0.295", 7.50mm Width) Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

OPA569AIDWP specifications
ParameterValue
Output typeRail-to-Rail
MountingSurface Mount
Amplifier typeGeneral Purpose
Voltage - input offset500 µV
Voltage - supply span5.5 V
Current - supply9mA
Current - input bias1 pA
Current - output (Channel)2.4 A
Operating temperature-40°C ~ 85°C
Gain bandwidth product1.2 MHz
PackageTube
Slew rate1.2V/µs
Case20-SOIC (0.295\", 7.50mm Width) Exposed Pad
Number of circuits1

Product details

2.4 A output op-amp for high-drive loads

The OPA569AIDWP is a single-channel, general-purpose operational amplifier from Texas Instruments that delivers 2.4 A of output current per channel — enough to directly drive a motor winding, a solenoid, or a high-power LED string without an external buffer stage. With a gain-bandwidth product of 1.2 MHz and a slew rate of 1.2 V/µs, it is sized for moderate-speed control loops and signal conditioning where the load current dominates the design choice, not the bandwidth.

Rail-to-rail output and wide supply range

The rail-to-rail output stage swings within millivolts of the supply rails, preserving headroom when the load pulls the output near the supply limit — important in a 2.4 A driver where every volt of drop is dissipated as heat in the die. Supply span runs from 2.7 V to 5.5 V, covering single-cell Li-ion through regulated 5 V rails, so the same BOM line serves portable and line-powered designs. Quiescent supply current is 9 mA — the part does not idle hot even when the output is not sourcing load current, which matters in a thermally constrained 20-HSOIC package.

20-HSOIC exposed-pad thermal management

The 20-SOIC package with exposed pad (0.295-inch body width, 7.50 mm) routes the die's heat through the pad to the PCB copper plane — the layout must include a thermal land and vias to a ground plane to keep the junction temperature within the -40°C to 85°C operating range under continuous 2.4 A load. Surface-mount assembly on the 20-HSOIC footprint; the exposed pad is the primary thermal path, so the solder paste coverage under the pad should match the recommended stencil aperture in the TI application note.

DC precision for the signal chain

Input offset voltage is 500 µV maximum, and input bias current is 1 pA typical at 25°C — the bias current doubles every 10°C, so at 85°C it sits around 64 pA, still negligible for a 10 kΩ source but a factor in a high-impedance sensor front-end. These DC specs mean the OPA569AIDWP can serve as the drive stage in a precision current source or as the output buffer in a DAC signal chain without adding an appreciable error term.

Active production and compliance

The part is ROHS3 Compliant, meeting the latest EU restriction directive without exemption.

Frequently asked questions

What is the output current capability of OPA569AIDWP?

The OPA569AIDWP delivers 2.4 A per channel. This is a single-channel op-amp, so the full 2.4 A is available from the single output.

What package does OPA569AIDWP come in?

It is supplied in a 20-SOIC package with an exposed pad (0.295" body width, 7.50 mm), also referred to as 20-HSOIC. The package is surface-mount and shipped in tube form.

What compliance documentation does Texas Instruments provide for OPA569AIDWP?

Texas Instruments certifies the OPA569AIDWP as ROHS3 Compliant. The active lifecycle status means current datasheets, application notes, and PCN notifications are available from the manufacturer.