What the 3 MHz gain-bandwidth and 1.5 V/µs slew rate mean for your signal chain
The OPA171AID is a single-supply, rail-to-rail output operational amplifier from Texas Instruments, delivering a 3 MHz gain-bandwidth product and a 1.5 V/µs slew rate in the standard 8-SOIC footprint. A 3 MHz GBW means the closed-loop gain-bandwidth product stays constant — at a gain of 10, the usable signal bandwidth is roughly 300 kHz, enough for audio, sensor conditioning, and motor-control feedback paths. The 1.5 V/µs slew rate sets the large-signal rise time: a 10 V output step settles in about 6.7 µs, which keeps distortion low for 20 kHz audio signals. The rail-to-rail output stage swings within 50 mV of the supply rails, so the part runs from a single 5 V rail and still delivers a 4.9 V peak-to-peak swing into a 10 kΩ load — no negative supply needed for many single-supply ADC driver or filter stages.
Supply range, quiescent current, and input bias — the power and sensor interface story
Supply span from 2.7 V to 36 V covers common rails: 3.3 V, 5 V, 12 V, and 24 V industrial supplies. The 475 µA typical quiescent current per amplifier keeps the thermal budget low in a densely populated board — eight of these on a 24 V rail draw under 4 mA total. Input bias current is 8 pA typical at 25 °C, doubling every 10 °C. At 85 °C it sits around 128 pA, still negligible for a 10 kΩ source but significant for a 1 MΩ piezoelectric or photodiode front-end where the bias current develops a DC error voltage across the source resistance. Maximum input offset voltage is 250 µV — for a gain of 100, the DC error at the output is 25 mV, acceptable for most sensor-conditioning loops but worth derating if the application requires sub-mV precision at the ADC input.
Temperature range, package, and production status for BOM planning
Rated for -40°C to +125°C operating temperature, the OPA171AID fits industrial and automotive under-hood environments where the ambient sees 105°C on a summer grade with margin to the 125°C junction limit. Housed in an 8-SOIC package (3.90 mm body width), the part is surface-mount with a 1.27 mm pitch — a standard footprint that routes on two-layer boards without via fan-out. The supplier device package is 8-SOIC, matching the JEDEC MS-012 variation.
Sourcing and compliance documentation
The OPA171AID is quoted to order against BOM quantities through independent and authorized distribution channels. Current pricing and lead time are confirmed at RFQ time. Texas Instruments provides RoHS3 compliance documentation for the OPA171AID.