Texas Instruments LMV1032UR-15/NOPB — Memory (DRAM / SRAM / Flash / EEPROM)
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Texas Instruments / Memory (DRAM / SRAM / Flash / EEPROM)

LMV1032UR-15/NOPB Class AB Microphone Amp, 1.7-5V, DSBGA

MPN LMV1032UR-15/NOPB
End of Life Spot Stock · 24-48h Dispatch 100% Original Sealed

Texas Instruments LMV1032UR-15/NOPB Class AB microphone amplifier, 1.7V-5V supply, 1-Channel Mono output, 4-DSBGA package, -40°C to +85°C.

In Stock: 2,825 pcs
MOQ: 1 pcs
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1+ pcs
$1.22
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$1.10
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$1.22 / ea

2,825 in stock — maximum per order · 3–4 days lead time

$1.10 / ea from 10 pcs

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[SPEC] Essential Parameters Snapshot Full Specifications (8)
Package / Case 4-XFBGA, DSBGA
Supply Voltage 1.7V ~ 5V

Full Technical Specifications

8 Parameters
LMV1032UR-15/NOPB specifications
Parameter / AttributeSpecification / Value
TypeClass AB
Output type1-Channel (Mono)
MountingSurface Mount
Supply voltage1.7V ~ 5V
Operating temperature-40°C ~ 85°C (TA)
PackageBulk
FeaturesMicrophone
Case4-XFBGA, DSBGA
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Technical Details & Description

Microphone preamp in a 1.2 mm² footprint

The LMV1032UR-15/NOPB is a Class AB amplifier designed specifically for 3-wire electret condenser microphone (ECM) interfaces. Its 1.7V to 5V supply range lets it run from a single Li-ion cell or a 3.3V regulator rail without a separate bias supply. The 4-DSBGA package (0.5 mm pitch, 0.8 mm × 0.8 mm body) places the amplifier directly under the microphone capsule in a compact handset or headset assembly. The mono output drives the downstream codec or DSP input directly.

Supply and temperature envelope

Operating temperature spans -40°C to +85°C (TA), covering industrial and consumer environments. The wide supply tolerance means the amplifier maintains gain and noise performance even as a battery discharges from 5V down to 1.7V. The DSBGA package requires careful PCB layout: the 0.5 mm pitch demands a solder mask defined pad with a 0.25 mm aperture and a 0.3 mm solder paste stencil. A 4-layer board with a solid ground plane under the package is recommended for thermal and electrical stability.

Sourcing and lifecycle status

It is sourced through authorized distribution channels; availability and current pricing are confirmed at RFQ against the BOM quantity. No official pin-compatible second source or successor is listed. The part is sole-sourced to TI; for a BOM hedge, confirm the supply lead time at quote time.

Frequently asked questions

What package does LMV1032UR-15/NOPB use and what is the soldering pitch?

It comes in a 4-bump DSBGA (4-XFBGA) package with 0.5 mm pitch. The body is 0.8 mm × 0.8 mm, requiring a solder mask defined pad and a 0.25 mm stencil aperture for reliable assembly.

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