LMK00804BQWRGTTQ1

Texas Instruments

Texas Instruments LMK00804BQWRGTTQ1, Automotive AEC-Q100 Fanout Buffer (Distribution), 2:4 ratio, 350 MHz max, 1.425V–3.465V supply, 16-VFQFN Exposed Pad, -40°C to 125°C.

Texas Instruments LMK00804BQWRGTTQ1
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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

LMK00804BQWRGTTQ1 specifications
Parameter / AttributeSpecification / Value
TypeFanout Buffer (Distribution)
SeriesAutomotive, AEC-Q100
MountingSurface Mount, Wettable Flank
Supply voltage1.425V ~ 3.465V
Frequency - max350 MHz
Operating temperature-40°C~125°C(TA)
InputHCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, SSTL
OutputLVCMOS, LVTTL
PackageTape & Reel (TR); Cut Tape (CT)
Case16-VFQFN Exposed Pad
Number of circuits1
Ratio - Input:Output2:4
Differential - Input:OutputYes/No

Technical details

350 MHz fanout buffer for automotive clock trees

The LMK00804BQWRGTTQ1 is a 2:4 fanout buffer — two input channels each distribute to two outputs, giving four LVCMOS/LVTTL outputs from differential or single-ended sources. The 350 MHz maximum frequency sets the ceiling for clock distribution; at that rate the output rise time into the load capacitance, not the buffer itself, limits the usable fan-out in a real PCB trace. Input compatibility spans HCSL, LVCMOS, LVDS, LVHSTL, LVPECL, LVTTL, and SSTL — this covers the common clock sources from PCIe reference oscillators to FPGA differential outputs.

AEC-Q100 Grade 1 — the temperature band for under-hood and engine bay

The 125°C upper limit aligns with under-hood and engine-bay environments where a 105°C summer soak still leaves margin.

Package footprint and thermal pad design rule

Housed in a 16-VFQFN with exposed pad, 3x3 mm body (supplier device package 16-VQFN). The wettable flank option aids AOI inspection after reflow — the side solder fillet is visible to the camera, which standard QFN side-wall plating does not guarantee. The exposed pad must be soldered to the PCB ground plane to achieve the datasheet thermal resistance; a 3x3 mm pad with at least nine thermal vias under the die attach area is the typical layout rule.

LMK00804BQWRGTTQ1
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