16-SOIC footprint and what it demands of the board
The LM13700M/NOPB comes in a 16-SOIC package (0.154" body width, 3.90 mm) — the standard narrow SOIC footprint that routes out to 1.27 mm pitch pads. The tube delivery means the parts are shipped in anti-static tubes, not tape-and-reel; for pick-and-place, the tube must be loaded into a tube feeder or the parts transferred to tape. The 16-SOIC lands on a single row of eight pins per side; the thermal pad is absent, so all heat dissipates through the leads and the board copper. For a dual transconductance amplifier drawing 2.6 mA per channel (5.2 mA total), the junction temperature rise is modest even in still air, but if the output is driving heavy loads near the 500 µA per-channel limit, the copper pour under the SOIC helps keep the die within the 0°C to 70°C commercial range.
50V/µs slew rate and 2 MHz GBW — the analog signal-chain fit
The 50V/µs slew rate and 2 MHz gain-bandwidth product define the small-signal bandwidth and the large-signal response. For a transconductance amplifier (OTA), the output is a current, not a voltage — the 50V/µs figure applies to the voltage at the output pin when loaded by the external resistor. In practice, if the OTA drives a 10 kΩ load to ground, the voltage swing is limited by the 500 µA output current (5 V peak into 10 kΩ), and the slew rate is not the bottleneck; the GBW of 2 MHz sets the closed-loop bandwidth for a given transconductance gain. A customer designing a variable-gain amplifier or a filter with the LM13700 should budget the 400 nA input bias current and 300 µV input offset — these set the DC accuracy floor for the signal chain.