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ROHM Semiconductor RBR20T30ANZC9 — Discrete Semiconductors

RBR20T30ANZC9 ROHM Schottky Diode, 10 A, 30 V, TO-220FN

MPNRBR20T30ANZC9
End of Life

ROHM Semiconductor RBR20T30ANZC9 Schottky diode, 1 Pair Common Cathode, 10 A average rectified per diode, 30 V reverse, 550 mV forward drop at 10 A, Fast Recovery, TO-220-3 Full Pack (TO-220FN), Through Hole.

$1.6Ref. price · indicative, final on quote
PackagingTO-220-3 Full Pack
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

RBR20T30ANZC9 specifications
ParameterValue
Diode typeSchottky
MountingThrough Hole
Voltage - DC reverse (Vr)30 V
Voltage - forward (Vf) (Max) @ if550 mV @ 10 A
Current - reverse leakage @ vr200 µA @ 30 V
Current - average rectified (Io) (per diode)10A
Operating temperature - junction150°C
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTube; Cut Tape (CT)
CaseTO-220-3 Full Pack
Diode configuration1 Pair Common Cathode

Product details

The RBR20T30ANZC9 is a Schottky barrier diode from ROHM Semiconductor, configured as a 1 Pair Common Cathode in a single TO-220FN package. It is rated for 10 A average rectified current per diode and a maximum reverse voltage of 30 V. Reverse leakage is 200 µA at the rated 30 V reverse voltage and 150°C junction temperature — the leakage doubles the thermal burden at high ambient, so the heatsink must account for it. The Fast Recovery classification (≤ 500 ns, > 200 mA Io) confirms this is a standard-speed Schottky, not an ultrafast or SiC device — suitable for line-frequency rectification and moderate-frequency switching up to a few tens of kHz.

Housed in a TO-220-3 Full Pack (TO-220FN) through-hole package, the fully molded case provides electrical isolation between the tab and the heatsink — no insulating pad or washer is needed when mounting to a grounded chassis or heatsink. The three leads are standard 0.100-inch pitch, compatible with 0.040-inch diameter PCB holes. The through-hole mounting requires a soldering iron or wave-solder profile; the large tab area conducts heat to the board or external heatsink. Junction temperature is rated to 150°C, so the thermal interface must keep the junction below this under full load.

Active production and compliance

Available in Tube or Cut Tape (CT) packaging.

Frequently asked questions

What compliance documentation does ROHM provide for RBR20T30ANZC9?

ROHM Semiconductor certifies the RBR20T30ANZC9 as ROHS3 compliant. No REACH, UL, or IEC certification is listed in the available specifications.