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ROHM Semiconductor RBQ10T45ANZC9 — Discrete Semiconductors

RBQ10T45ANZC9 ROHM Schottky Diode, 10A, 45V, TO-220FN

MPNRBQ10T45ANZC9
End of Life

ROHM Semiconductor RBQ10T45ANZC9 Schottky diode, 1 pair common cathode, 10 A average rectified per diode, 45 V reverse, 650 mV forward drop at 5 A, TO-220-3 Full Pack (TO-220FN), tube.

$1.23Ref. price · indicative, final on quote
PackagingTO-220-3 Full Pack
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

RBQ10T45ANZC9 specifications
ParameterValue
Diode typeSchottky
MountingThrough Hole
Voltage - DC reverse (Vr)45 V
Voltage - forward (Vf) (Max) @ if650 mV @ 5 A
Current - reverse leakage @ vr70 µA @ 45 V
Current - average rectified (Io) (per diode)10A
Operating temperature - junction150°C
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTube
CaseTO-220-3 Full Pack
Diode configuration1 Pair Common Cathode

Product details

10 A per diode, 45 V reverse — the power rail sizing number

The RBQ10T45ANZC9: That 10 A per leg sets the continuous current ceiling for the output rail — two diodes in one package share the load in a center-tap or half-bridge topology, so the total package handles up to 20 A in a two-diode forward path. Forward voltage is 650 mV typical at 5 A, which defines the conduction loss floor for thermal design. At 10 A per diode the Vf will be higher — budget the junction temperature rise from the TO-220FN package's thermal resistance to the heatsink tab.

Low reverse leakage and switching speed

Reverse leakage is specified at 70 µA at 45 V — the part description flags this as a low-IR variant, meaning it holds leakage well below the typical Schottky curve at rated voltage. The fast-recovery rating (≤500 ns, >200 mA Io) confirms this is a switching diode, not a 50/60 Hz line rectifier. The 500 ns recovery ceiling is adequate for 100-200 kHz SMPS designs; above that frequency the reverse-recovery charge starts to dominate switching loss.

TO-220FN — fully isolated, no pad isolation needed

The TO-220-3 Full Pack (also called TO-220FN) is a fully molded, isolated package — the metal tab is encapsulated, so no insulating pad or washer is required between the device and the heatsink. This simplifies assembly in through-hole power stages where the heatsink is chassis-grounded or shared across multiple devices. The junction temperature limit is 150 °C. With the full-pack package's higher thermal resistance compared to a standard TO-220, the actual current derating at elevated ambient temperature is steeper — confirm the junction temperature at your operating point before committing the BOM.

ROHS3 compliant, so it meets the current EU restriction directive without exemption expiry concerns.

Frequently asked questions

What package does RBQ10T45ANZC9 use?

Through-hole TO-220-3 Full Pack, also designated TO-220FN. The package is fully molded and isolated — no separate insulating pad is needed for heatsink mounting.