RB218BM200FHTL

ROHM Semiconductor · Automotive, AEC-Q101 Series

ROHM Semiconductor RB218BM200FHTL, Automotive AEC-Q101 Schottky Diode, 200V Vr, 20A Io per diode, 1 Pair Common Cathode, TO-252-3 DPak, Surface Mount.

ROHM Semiconductor RB218BM200FHTL
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[IN STOCK] In Stock: 42 pcs
$1.26/ pc

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MOQ 1 · Tape & Reel (TR); Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

RB218BM200FHTL specifications
Parameter / AttributeSpecification / Value
SeriesAutomotive, AEC-Q101
Diode typeSchottky
MountingSurface Mount
Voltage - DC reverse (Vr)200 V
Voltage - forward (Vf) (Max) @ if880 mV @ 10 A
Current - reverse leakage @ vr10 µA @ 200 V
Current - average rectified (Io) (per diode)20A
Operating temperature - junction150°C (Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageTape & Reel (TR); Cut Tape (CT)
CaseTO-252-3, DPak (2 Leads + Tab), SC-63
Diode configuration1 Pair Common Cathode

Technical details

Device identity and headline ratings

The RB218BM200FHTL: Each diode is rated for 200 V reverse voltage and 20 A average rectified current, making it suitable for high-current, fast-switching applications in automotive power systems.

Switching speed and thermal limits

The device is classified as a fast recovery type, with a recovery time of 500 ns or less at currents above 200 mA — this suits it for continuous conduction mode (CCM) boost or flyback converters where reverse recovery losses matter. Forward voltage is specified at 880 mV maximum when carrying 10 A per diode — this conduction loss figure, combined with the 10 µA reverse leakage at 200 V, gives the thermal designer the data needed for junction temperature estimation in the target duty cycle.

Automotive qualification and package fit

The RB218BM200FHTL is qualified to AEC-Q101, the automotive discrete semiconductor stress test standard, covering temperature cycling, high-temperature reverse bias, and ESD robustness. This qualification is required for underhood or chassis-mounted power stages in passenger vehicles. The surface-mount form factor suits automated pick-and-place assembly for high-volume production lines.

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