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ROHM Semiconductor BD18GA5MEFJ-LBH2 — Power Management (PMIC / Gate Driver)

BD18GA5MEFJ-LBH2 ROHM LDO, 1.8V Fixed Output, 500mA

MPNBD18GA5MEFJ-LBH2
End of Life

ROHM Semiconductor BD18GA5MEFJ-LBH2 LDO regulator, fixed 1.8V output, 500mA, positive output configuration, 8-SOIC exposed pad package, surface mount, -40°C to 105°C.

$2.55Ref. price · indicative, final on quote
Packaging8-SOIC (0.154", 3.90mm Width) Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

BD18GA5MEFJ-LBH2 specifications
ParameterValue
Output typeFixed
MountingSurface Mount
Voltage - input14V
Voltage dropout1.2V @ 500mA
Voltage - output (Min (Fixed))1.8V
Output current500mA
Current - quiescent1.2 mA
Operating temperature-40°C ~ 105°C
PackageTape & Reel (TR); Cut Tape (CT)
Case8-SOIC (0.154\", 3.90mm Width) Exposed Pad
Control featuresEnable, Soft Start
Protection featuresOver Current, Over Temperature, Short Circuit
Number of regulators1
Output configurationPositive

Product details

Fixed 1.8V rail at 500 mA — headroom and dropout

The BD18GA5MEFJ-LBH2 is a positive-output LDO regulator from ROHM Semiconductor delivering a fixed 1.8V output at up to 500 mA. Quiescent current is 1.2 mA typical, a figure that sets the standby power floor for always-on domains in the system. The single regulator channel with Enable and Soft Start control features supports power sequencing — the Enable pin gates the output, and Soft Start limits inrush current during startup, reducing stress on the upstream supply.

Industrial temperature grade and protection suite

The protection set includes Over Current, Over Temperature, and Short Circuit — the thermal shutdown prevents die damage during sustained overload, while current limiting folds back the output during a hard short. The 8-SOIC package with exposed pad (supplier device package 8-HTSOP-J) requires a thermal land on the PCB to conduct heat into the board plane. The exposed paddle is the primary thermal path — without a soldered connection to a copper pour, the junction-to-ambient thermal resistance rises significantly, and the 500 mA output capability may be thermally limited at the high end of the temperature range.

Frequently asked questions

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