What 470 µF at 2.5 V means for the rail
The 2R5TPE470MI: 470 µF at 2.5 V is a mid-range bulk-decoupling value in a compact 2917 (7343 metric) footprint — the sort of cap that sits close to a processor core rail or a power-stage input where you need charge reservoir capability without eating board real estate.
Thermal grade and endurance for the BOM
-55 to 105 °C operating range covers the full commercial-to-industrial temperature band; the 105 °C ceiling is the rating point, not the ambient the cap sees in the box — derate toward the mid-80s in a sealed enclosure and the 2000-hour lifetime at rated temperature gives you a conservative design floor for a consumer or industrial board. The 2917 package with a 2.00 mm seated height leaves little vertical margin — confirm your clearance under any heatsink or adjacent connector before committing; the mold compound is the structural element and the board-side pad landing must be coplanar across the full tab width to avoid cracking on thermal cycling.