Package and board-fit: 257-ball LFBGA at 14x14 mm
The SPC5744PGK1AMMM9 ships in a 257-LFBGA (14x14 mm) package — a fine-pitch BGA that demands a multi-layer PCB with controlled-impedance routing for the FlexRay and Ethernet differential pairs.
Core and memory: dual e200z4 with 2.5 MB flash
The dual-core e200z4 runs at 200 MHz — each core implements Power Architecture v2.06 with a single-precision FPU, so control loops and sensor fusion algorithms execute deterministically without a floating-point emulation penalty. On-chip flash is 2.5 MB (2.5M x 8) with 384 KB SRAM — enough headroom for a full AUTOSAR stack plus application code, leaving the external memory bus free for data logging or display buffers. The 64-channel 12-bit ADC bank samples analog sensors directly — no external mux needed for a typical engine management or battery-monitoring front-end.
Connectivity and peripherals for safety-critical networks
CANbus, FlexRay, and Ethernet are all on-die — the MCU bridges legacy CAN 2.0 networks to a 100BASE-T1 backbone without an external gateway chip. DMA, LVD, POR, and WDT peripherals handle the housekeeping: the DMA offloads the cores during high-speed SPI or UART transfers, while the low-voltage detect and watchdog enforce fail-safe shutdown in a safety-rated system. Internal oscillator means no external crystal is strictly required for basic operation — though a precision clock source is recommended for FlexRay and Ethernet timing compliance.
ROHS3 compliant — no exemption issues for EU or global markets; the part ships in tray packaging.