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NXP Semiconductors SC16C852SVIET151 — Discrete Semiconductors

NXP SC16C852SVIET151 DUART, 20Mbps, 36-TFBGA

MPNSC16C852SVIET151
End of Life

NXP Semiconductors SC16C852SVIET151 DUART serial I/O controller, 2-channel, 128 Byte FIFO, 20Mbps RS485, 1.8V, 36-TFBGA (3.5x3.5), Bulk.

$2.46Ref. price · indicative, final on quote
Packaging36-TFBGA
StockIn Stock (22)
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

SC16C852SVIET151 Technical Specifications
ParameterValue
Mounting typeSurface Mount
Voltage1.8V
ProtocolRS485
FIFO's128 Byte
PackageBulk
Case36-TFBGA
Data rate20Mbps
Number of channels2, DUART
With modem controlYes
With auto flow controlYes
With IrDA encoder (Decoder)Yes
With false start bit detectionYes

Product details

Dual UART with 128-byte FIFO and 20 Mbps RS485

The SC16C852SVIET151 is a 2-channel DUART (dual universal asynchronous receiver/transmitter) from NXP, supporting RS485 protocol at a maximum data rate of 20 Mbps. Each channel carries a 128-byte FIFO, which buffers incoming and outgoing data to reduce CPU interrupt overhead in high-throughput serial links. It includes modem control, auto flow control, an IrDA encoder/decoder, and false start bit detection — the full feature set for industrial RS485 networks where collision avoidance and framing integrity matter.

36-ball TFBGA — reflow and board-fit checklist

Housed in a 36-TFBGA (3.5x3.5 mm) with 0.50 mm ball pitch, this package demands a controlled reflow profile. Check the MSL rating before the oven — a high-MSL part that skips the bake step risks popcorning during reflow, lifting balls off the pad. The 1.8 V supply rail keeps core power low, but the BGA's small footprint means the PCB fan-out must clear the inner balls. A 4-layer board with microvias is typical for this pitch class.

Frequently asked questions

What is the data rate and FIFO depth of this DUART?

The SC16C852SVIET151 supports a maximum data rate of 20 Mbps and each of its two channels has a 128-byte FIFO. This combination handles high-speed RS485 links without saturating the host processor.

What package does the SC16C852SVIET151 use and what are the reflow considerations?

It comes in a 36-TFBGA (3.5x3.5 mm) with 0.50 mm ball pitch. Surface-mount reflow requires a controlled profile — confirm the MSL level before the oven to avoid popcorning. The small BGA footprint typically needs a 4-layer PCB with microvias for fan-out.