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NXP Semiconductors PCA9410AUKZ — Discrete Semiconductors

NXP PCA9410AUKZ Boost Converter, 5V Fixed Output, 500mA

MPNPCA9410AUKZ
End of Life

NXP Semiconductors PCA9410AUKZ step-up DC-DC converter, boost topology, fixed 5V output, 500mA, 3MHz switching, synchronous rectifier, 9-WLCSP (1.24x1.24) package, surface mount.

$1.34Ref. price · indicative, final on quote
Packaging9-UFBGA, WLCSP
StockContact for availability
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

PCA9410AUKZ Technical Specifications
ParameterValue
Output typeFixed
Mounting typeSurface Mount
Voltage - input5.25V
Voltage - output (Min (Fixed))5V
Current - output500mA
Frequency3MHz
Number of outputs1
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
FunctionStep-Up
TopologyBoost
Case9-UFBGA, WLCSP
Output configurationPositive
Synchronous rectifierYes

Product details

Boost converter for 5V rails from a 2.5V min input

The NXP PCA9410AUKZ is a step-up (boost) DC-DC converter delivering a fixed 5V output at up to 500 mA from an input range of 2.5V to 5.25V. With a 3 MHz switching frequency and integrated synchronous rectifier, external inductor and capacitor values stay small — the 3 MHz carrier pushes the ripple into a band where a 1 µH inductor and 10 µF output cap typically suffice, shrinking the total solution footprint.

Package and board-fit: 9-WLCSP rework reality

Housed in a 9-bump WLCSP measuring 1.24 x 1.24 mm (supplier device package 9-WLCSP), the PCA9410AUKZ requires a solder-paste stencil with aperture openings matched to the bump pitch — typically 0.4 mm pitch for this class of WLCSP. The wafer-level chip-scale package has no molded body, so the die backside is exposed; a no-clean flux residue left under the die can trap moisture and cause popcorning during reflow. A pre-bake at 125 °C for 8 hours is recommended if the parts have been exposed to ambient humidity beyond the MSL floor life.