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NXP Semiconductors NXPS20H100C,127 — Discrete Semiconductors
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NXP Semiconductors / Discrete Semiconductors

NXPS20H100C,127 NXP Schottky Diode, 20 A, 100 V, TO-220-3

MPN NXPS20H100C,127
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NXP Semiconductors NXPS20H100C,127 Schottky rectifier, dual common-cathode, 20 A total (10 A per diode), 100 V Vrrm, 770 mV Vf at 10 A, TO-220AB through-hole, Bulk.

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[SPEC] Essential Parameters Snapshot Full Specifications (11)
Package / Case TO-220-3
Speed / Frequency Fast Recovery =< 500ns, > 200mA (Io)

Full Technical Specifications

11 Parameters
NXPS20H100C,127 specifications
Parameter / AttributeSpecification / Value
Diode typeSchottky
MountingThrough Hole
Voltage - DC reverse (Vr)100 V
Voltage - forward (Vf) (Max) @ if770 mV @ 10 A
Current - reverse leakage @ vr4.5 µA @ 100 V
Current - average rectified (Io) (per diode)10A
Operating temperature - junction175°C (Max)
SpeedFast Recovery =< 500ns, > 200mA (Io)
PackageBulk
CaseTO-220-3
Diode configuration1 Pair Common Cathode
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Technical Details & Description

Switching speed and reverse leakage

The NXPS20H100C,127: Classified as Fast Recovery (trr ≤ 500 ns, Io > 200 mA), the diode handles the reverse-recovery charge of a 100 kHz boost or flyback stage without excessive ringing — the Schottky barrier itself has negligible stored charge, so the speed rating is conservative for most SMPS designs. Reverse leakage is 4.5 µA at 100 V, 25°C; at 125°C junction the leakage rises exponentially and can dominate the off-state loss in a high-temperature PFC stage.

Frequently asked questions

What package does NXPS20H100C,127 come in?

Through-hole TO-220-3, also designated TO-220AB by NXP. The mounting tab is the common cathode — the PCB footprint must connect the tab pad to the output rail and provide adequate copper area for heat spreading.

What is the maximum junction temperature and reverse leakage at rated voltage?

Junction temperature is rated to 175°C maximum. Reverse leakage at 100 V is 4.5 µA typical at 25°C — expect a significant increase above 100°C junction, which must be factored into the thermal design.

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