Skip to main content
NXP Semiconductors MPC8306SCVMABDCA — Discrete Semiconductors

MPC8306SCVMABDCA PowerPC e300c3, 133MHz, Industrial Temp

MPNMPC8306SCVMABDCA
End of Life

NXP MPC8306SCVMABDCA PowerQUICC II Pro, PowerPC e300c3 core, 133 MHz, 369-PBGA, USB 2.0, 3x 10/100 Ethernet, -40°C to 105°C.

$23.42Ref. price · indicative, final on quote
Packaging369-LFBGA
SeriesMPC83xx
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MPC8306SCVMABDCA specifications
ParameterValue
SeriesMPC83xx
MountingSurface Mount
Voltage - i (O)1.8V, 3.3V
Additional interfacesDUART, I²C, SPI, TDM
Operating temperature-40°C ~ 105°C (TA)
Number of cores (Bus width)1 Core, 32-Bit
USBUSB 2.0 (1)
Speed133MHz
PackageBulk
Ethernet10/100Mbps (3)
Core processorPowerPC e300c3
Case369-LFBGA
RAM controllersDDR2
Co-Processors (DSP)Communications; QUICC Engine
Graphics accelerationNo

Product details

133 MHz PowerPC e300c3 with on-chip QUICC Engine

The MPC8306SCVMABDCA is a single-core PowerQUICC II Pro system-on-chip built around the PowerPC e300c3 core running at 133 MHz. It integrates a QUICC Engine co-processor that handles communications protocol processing independently from the main core, freeing CPU cycles for application code. On-chip connectivity includes one USB 2.0 port and three 10/100 Mbps Ethernet MACs, making this SoC suited for industrial gateways, protocol converters, and networked control applications where multiple wired interfaces terminate at a single processor.

Industrial temperature grade and memory interface

The integrated DDR2 memory controller supports standard DDR2 SDRAM, which at 133 MHz core speed provides adequate memory bandwidth for packet buffering and control-plane data. The 32-bit data bus width keeps the PCB routing density manageable on a 4-layer board.

Peripheral set and package footprint

Additional serial interfaces include DUART, I²C, SPI, and TDM — covering the common control buses for industrial sensors, motor drives, and fieldbus PHYs. The TDM port can connect to an external T1/ framer or a multi-channel codec for voice or telemetry streams. Housed in a 369-ball PBGA package measuring 19x19 mm (supplier device package 369-PBGA), the ball pitch is 0.80 mm — routable on a 4-layer PCB with standard via technology. The surface-mount package requires a solder reflow profile per JEDEC J-STD-020 for the lead-free solder balls.

Active lifecycle — sourcing posture

The part ships in bulk packaging as standard.

Frequently asked questions

What is the core speed and architecture of the MPC8306SCVMABDCA?

The device uses a single PowerPC e300c3 core running at 133 MHz, with a 32-bit data bus width. This is the same core family used across the MPC83xx series, so existing PowerPC toolchains and RTOS ports apply directly.

What connectivity interfaces does this SoC provide?

It integrates one USB 2.0 port, three 10/100 Mbps Ethernet MACs, a QUICC Engine co-processor for protocol offload, plus DUART, I²C, SPI, and TDM serial interfaces. The Ethernet MACs support RMII/RGMII connections to external PHYs.