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NXP Semiconductors MPC17559EPR2 — Analog & Data Acquisition

MPC17559EPR2 NXP Motor Driver, 10 Half-Bridge, 300mA, QFN

MPNMPC17559EPR2
End of Life

NXP Semiconductors MPC17559EPR2 fully integrated motor driver, Power MOSFET technology, 10 half-bridge outputs, 300mA, Parallel interface, 56-VFQFN package, Bulk.

$6.05Ref. price · indicative, final on quote
Packaging56-VFQFN
RoHSROHS3 Compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MPC17559EPR2 specifications
ParameterValue
MountingSurface Mount
Motor type - AC, DCBrushless DC (BLDC), Brushed DC
Voltage - load0.9V ~ 3.5V
Voltage1.8V ~ 3.5V
Output current300mA
InterfaceParallel
Operating temperature-20°C ~ 65°C (TA)
PackageBulk
FunctionDriver - Fully Integrated, Control and Power Stage
TechnologyPower MOSFET
ApplicationsBattery Powered
Case56-VFQFN
Output configurationHalf Bridge (10)

Product details

Battery-powered motor control with ten half-bridges

The MPC17559EPR2 is a fully integrated motor driver from NXP that combines control logic and power stage in one 56-QFN package. It drives both brushless DC (BLDC) and brushed DC motors from a battery supply, with the load voltage spanning 0.9V to 3.5V and the logic supply running on 1.8V to 3.5V. Ten half-bridge outputs give this part unusual flexibility for its class — enough to drive a three-phase BLDC motor with six bridges and still have four left for solenoids, latches, or a second smaller motor. Each bridge is rated for 300mA continuous output.

What the 300mA and ten bridges mean for your BOM

300mA per half-bridge at the rated load voltage means this driver is sized for small battery-powered actuators — think camera lens motors, haptic feedback, portable pump drives, or toy-grade robotics. The ten bridges let you run, for example, two three-phase BLDC motors (six bridges) plus four brushed DC motors (one bridge each) from a single IC. The Power MOSFET output stage keeps conduction losses low at the 300mA operating point. With the supply rail at 3.5V max, the total dissipation across ten bridges stays within the 56-QFN's thermal budget when the ambient stays below 65°C.

Housed in a 56-VFQFN with an exposed pad (supplier package designation 56-QFN 8x8), the MPC17559EPR2 requires a surface-mount reflow profile compatible with lead-free solder. The parallel interface gives direct control over each half-bridge — no SPI or I2C setup overhead. This suits designs where the host MCU has spare GPIOs and needs deterministic switching latency.

Frequently asked questions

What is the closest functional alternative to MPC17559EPR2?

The MPC17559EPR2 comes in a 56-VFQFN (Bulk), while the MPC17559EP uses a different package format. Confirm the footprint compatibility before substituting.