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NXP Semiconductors MK82FN256VDC15 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP MK82FN256VDC15 Kinetis K8x MCU, 150 MHz, 256 KB Flash

MPNMK82FN256VDC15
End of Life

NXP Semiconductors Kinetis K8x ARM Cortex-M4 MCU, MK82FN256VDC15, 150 MHz, 256 KB flash, 256 KB SRAM, 87 I/O, 121-XFBGA (8x8 mm), -40 to 105°C.

$19.4Ref. price · indicative, final on quote
Packaging121-XFBGA
StockIn Stock (23)
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications

MK82FN256VDC15 Technical Specifications
ParameterValue
SeriesKinetis K8x
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.71V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed150MHz
PackageTray
RAM size256K x 8
Core size32-Bit Single-Core
PeripheralsDMA, I²S, LVD, POR, PWM
ConnectivityEBI/EMI, I²C, SPI, UART/USART, USB OTG
Number of i (O)87
Core processorARM® Cortex®-M4
Case121-XFBGA
Data convertersA/D 18x16b; D/A 2x6b, 1x12b
Program memory size256KB (256K x 8)

Product details

150 MHz Cortex-M4 with DSP and FPU

The MK82FN256VDC15 runs a single ARM Cortex-M4 core at 150 MHz — that is the ceiling for single-cycle MAC and hardware divide, so FOC loops on a motor drive or FFT bins on an audio front-end execute without waiting on the bus. The core size is 32-bit single-core, and the part includes DMA, I²S, LVD, POR, and PWM peripherals — the DMA offloads data movement from the CPU, leaving the M4 free to run the control algorithm.

Memory map for code and data

256 KB of flash and 256 KB of SRAM give a balanced split: the flash holds the application image and the SRAM provides a scratchpad for sensor buffers or a display frame store. The EBI/EMI interface extends memory off-chip — a NOR flash for code shadowing or an SRAM for data logging connects without glue logic, though the 121-ball XFBGA package routes the address/data bus through the inner balls, so the PCB stack-up and via fan-out must be planned early.

Analog and connectivity coverage

18 channels of 16-bit ADC cover multi-sensor acquisition — three-phase current sensing on a motor drive plus a thermistor on the heatsink all land on one ADC module sequenced by the DMA. The dual 6-bit DAC and single 12-bit DAC handle analog set-points or waveform generation.

Temperature grade and supply range

An engine-bay ECU or a conveyor-belt controller that sees 85°C on a summer afternoon still has 20°C of margin before the silicon derating curve bites.

Package and board integration

The 121-XFBGA package measures 8x8 mm with a 0.50 mm ball pitch — surface-mount only. The fine pitch forces a 4-layer PCB minimum for fan-out; the inner balls carry the EBI bus and the outer rings handle I/O and power. The supplier device package is 121-XFBGA (8x8).

ROHS3 compliant for global shipping without substance-restriction paperwork.

Frequently asked questions

What is MK82FN256VDC15's listed speed?

The core runs at 150 MHz on a single ARM Cortex-M4 with DSP extensions and a floating-point unit — enough headroom for a 20 kHz current-control loop or a 48 kHz audio processing pipeline.

What compliance documentation does NXP provide for MK82FN256VDC15?

The part is ROHS3 compliant.