Heterogeneous dual-core — one chip, two jobs
The MCIMX6X3EVK10AB is a heterogeneous dual-core microprocessor that pairs an ARM Cortex-A9 application core running at 1 GHz with an ARM Cortex-M4 real-time core at 227 MHz.
Dual gigabit Ethernet and CAN — wired for factory networks
Two 10/100/1000 Mbps Ethernet MACs with AVB support and multiple CAN interfaces give this part the wired connectivity profile that industrial and building-automation designs demand.
Memory controller flexibility — LPDDR2, LVDDR3, or DDR3
The integrated memory controller supports LPDDR2, LVDDR3, and DDR3, which gives the BOM engineer a real choice: LPDDR2 for battery-backed or thermally constrained enclosures, standard DDR3 for lowest per-bit cost in volume production.
It comes in a 400-MAPBGA package measuring 14x14 mm — a known footprint that rework technicians can handle with a standard BGA rework station, though the MSL rating (check the reel label) determines whether a pre-bake is needed before reflow.
Security features for trusted boot and encrypted firmware
A-HAB (Advanced High-Assurance Boot), ARM TrustZone, CAAM (Cryptographic Acceleration and Assurance Module), and secure JTAG are all on-die. For designs that must resist firmware extraction or enforce signed-update policies — think metering, payment terminals, or secure gateways — these blocks are ready without an external secure element.
For dual-sourcing resilience, the i.MX6SX family includes several density and speed-grade variants that share the same 400-MAPBGA footprint — confirm pin compatibility against your specific BOM before substituting.