Skip to main content
NXP Semiconductors MCIMX6U5DVM10ACR — Discrete Semiconductors

NXP MCIMX6U5DVM10ACR i.MX6DL, 1.0 GHz, 2-Core ARM Cortex-A9

MPNMCIMX6U5DVM10ACR
End of Life

NXP i.MX6DL series, ARM Cortex-A9 dual-core microprocessor, MCIMX6U5DVM10ACR, 1.0 GHz, 624-MAPBGA, USB 2.0 + PHY (4), Gigabit Ethernet, ROHS3 compliant.

$49.68Ref. price · indicative, final on quote
Packaging624-LFBGA
StockIn Stock (18)
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MCIMX6U5DVM10ACR Technical Specifications
ParameterValue
Seriesi.MX6DL
Mounting typeSurface Mount
Voltage - i (O)1.8V, 2.5V, 2.8V, 3.3V
Additional interfacesCAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Display & interface controllersKeypad, LCD
Operating temperature0°C ~ 95°C (TJ)
Number of cores (Bus width)2 Core, 32-Bit
USBUSB 2.0 + PHY (4)
Speed1.0GHz
PackageTape & Reel (TR); Cut Tape (CT)
Ethernet10/100/1000Mbps (1)
Core processorARM® Cortex®-A9
Case624-LFBGA
RAM controllersLPDDR2, LVDDR3, DDR3
Co-Processors (DSP)Multimedia; NEON™ SIMD
Security featuresARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Graphics accelerationYes

Product details

Dual-core Cortex-A9 at 1.0 GHz

The MCIMX6U5DVM10ACR is a dual-core ARM Cortex-A9 processor from the i.MX6DL series, clocked at 1.0 GHz. Each core is a 32-bit unit, giving the part a symmetric multiprocessing capability for running a main OS and a real-time task on separate cores without a hypervisor.

Memory and peripheral integration

Memory controllers support LPDDR2, LVDDR3, and DDR3, giving the BOM flexibility to use whichever DRAM type is most cost-effective at the target density. On the peripheral side, four USB 2.0 ports with integrated PHY eliminate external transceivers for most designs, and the single Gigabit Ethernet MAC (10/100/1000 Mbps) connects directly to an external PHY via the RGMII interface. Additional interfaces include CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, and UART, covering the common control and audio buses for an embedded system. The display controller handles keypad and LCD outputs, while the dedicated graphics acceleration block offloads 2D/3D rendering from the CPU cores.

Package, temperature, and rework considerations

Housed in a 624-ball MAPBGA (21x21 mm), the part is surface-mount only. The 0.8 mm ball pitch is reworkable with a good hot-air station and a stencil, but the large array means the board must be dry before reflow — the 0°C to 95°C junction temperature range is the operating envelope, not a storage spec, so the moisture sensitivity level (MSL) on the reel label governs bake requirements before rework. The 1.8V, 2.5V, 2.8V, and 3.3V I/O voltage rails mean the core runs on a separate supply from the memory and peripheral banks — a multi-rail PMIC or discrete LDOs are needed, not a single rail.

Security and compliance

On-chip security features include ARM TrustZone, boot security, cryptography, a secure fuse box, secure JTAG, secure memory, a secure RTC, and tamper detection. This qualifies the part for payment terminals, secure gateways, and any application where the boot chain must be locked against modification.

Frequently asked questions

Where can I buy MCIMX6U5DVM10ACR and get a price?

The MCIMX6U5DVM10ACR is sourced through independent and authorized distribution channels.

What is the core speed and architecture of MCIMX6U5DVM10ACR?

The MCIMX6U5DVM10ACR has a dual-core ARM Cortex-A9 processor running at 1.0 GHz, with 32-bit data width per core. It includes a NEON SIMD coprocessor for multimedia acceleration.