MCIMX6D6AVT08AD

NXP Semiconductors · i.MX6D Series

NXP i.MX6D series, MCIMX6D6AVT08AD, dual-core ARM Cortex-A9 MPU, 852MHz, LPDDR2/LVDDR3/DDR3, USB 2.0 + PHY (4), SATA 3Gbps (1), Gigabit Ethernet, -40°C to 125°C, 624-FCBGA (21x21).

NXP Semiconductors MCIMX6D6AVT08AD
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MOQ 1 · Tray · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

MCIMX6D6AVT08AD specifications
Parameter / AttributeSpecification / Value
Seriesi.MX6D
MountingSurface Mount
Voltage - i (O)1.8V, 2.5V, 2.8V, 3.3V
Additional interfacesCAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Display & interface controllersKeypad, LCD
Operating temperature-40°C ~ 125°C (TJ)
Number of cores (Bus width)2 Core, 32-Bit
USBUSB 2.0 + PHY (4)
SATASATA 3Gbps (1)
Speed852MHz
PackageTray
Ethernet10/100/1000Mbps (1)
Core processorARM® Cortex®-A9
Case624-FBGA, FCBGA
RAM controllersLPDDR2, LVDDR3, DDR3
Co-Processors (DSP)Multimedia; NEON™ SIMD
Security featuresARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Graphics accelerationYes

Technical details

Dual-core Cortex-A9 at 852 MHz — industrial-grade processing

The NXP MCIMX6D6AVT08AD is a dual-core ARM Cortex-A9 microprocessor from the i.MX6D series, clocked at 852 MHz. It integrates a NEON SIMD media coprocessor for accelerated multimedia and signal processing. The device supports LPDDR2 and DDR3 memory controllers, giving the system architect flexibility in memory cost and bandwidth. Four USB 2.0 ports with integrated PHY, a single SATA 3 Gbps interface, and one Gigabit Ethernet MAC provide wired connectivity for industrial gateways, HMI panels, and networked control systems.

Security and peripheral set for connected designs

Built-in security features include ARM TrustZone, secure boot, cryptographic acceleration, a secure fuse box, secure JTAG, secure memory, secure RTC, and tamper detection — covering the hardware root-of-trust requirements for payment terminals, secure IoT nodes, and industrial control with anti-tamper mandates. Additional interfaces such as CAN, I²C, I²S, MMC/SD/SDIO, SAI, SPI, SSI, and UART handle sensor fusion, audio codecs, and display/keypad controllers. The 624-ball FCBGA package (21x21 mm) is a surface-mount BGA that requires standard reflow profiling and X-ray inspection for voiding.

For new designs, the i.MX6D series remains a current-production choice with NXP's long-term supply commitment typical for industrial-grade processors. The part is ROHS3 compliant.

MCIMX6D6AVT08AD
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