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NXP Semiconductors MC33GD3000EP — Discrete Semiconductors

NXP MC33GD3000EP BLDC Motor Gate Driver, 6V-58V, 56-QFN

MPNMC33GD3000EP
End of Life

NXP Semiconductors MC33GD3000EP BLDC motor gate driver, SPI interface, 3-phase half-bridge, 6V-58V supply, 56-VFQFN Exposed Pad, Tray.

$6.19Ref. price · indicative, final on quote
Packaging56-VFQFN Exposed Pad
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MC33GD3000EP Technical Specifications
ParameterValue
Mounting typeSurface Mount
Voltage - load6V ~ 58V
Voltage6V ~ 58V
InterfaceSPI
Operating temperature-40°C ~ 125°C (TA)
PackageTray
FunctionController - Commutation, Direction Management
TechnologyPower MOSFET
ApplicationsAutomotive
Case56-VFQFN Exposed Pad
Output configurationHalf Bridge (3)

Product details

Active BLDC gate driver with wide 6V-58V supply rail

The MC33GD3000EP is an active-production BLDC motor pre-driver from NXP, built to handle a 6V to 58V supply on both the load and logic sides — one rail covers 12V and 24V automotive systems without a separate regulator. Its three half-bridge outputs drive external power MOSFETs in a 3-phase inverter stage, with commutation and direction managed through an SPI bus rather than hardwired logic pins.

Package and thermal path for motor-drive layouts

Housed in a 56-VFQFN with an exposed pad (8x8 mm body), the MC33GD3000EP relies on the PCB copper pour under the pad to pull heat from the driver stage — a 2 oz copper plane with thermal vias is the baseline for continuous motor operation.

Frequently asked questions

What package does the MC33GD3000EP come in?

It is supplied in a 56-VFQFN with an exposed pad (8x8 mm body), surface-mount, in tray packaging.

What compliance documentation does NXP provide for the MC33GD3000EP?

The device is ROHS3 compliant. No UL or IEC certification is listed in the summary; the automotive application designation implies internal qualification to NXP's automotive-grade stress tests.