System Basis Chip with integrated DC-DC
The NXP MC33FS6521NAE is a System Basis Chip (SBC) that integrates a 2.2 A DC-DC converter with control and monitoring functions for automotive ECU power management. The 48-HLQFP (7x7 mm) package with exposed pad provides a thermal path for the converter's output stage, so the PCB layout must include a via-stitched thermal land to keep junction temperatures within limits under continuous 2.2 A load.
It is ROHS3 compliant, which simplifies compliance for new designs targeting European or global automotive markets.
Package and thermal considerations for the 2.2 A converter
The 2.2 A DC-DC converter output means the power-stage losses will heat the die; the datasheet's thermal resistance figures (junction-to-ambient and junction-to-case) should be checked against the actual load current and ambient temperature to size the copper area.