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NXP Semiconductors MC33FS6502LAE — Logic ICs

NXP MC33FS6502LAE System Basis Chip, -40°C to 125°C

MPNMC33FS6502LAE
End of Life

NXP MC33FS6502LAE System Basis Chip, 1V ~ 5V supply, -40°C ~ 125°C, 48-LQFP Exposed Pad, 48-HLQFP (7x7), Tray, Surface Mount, ROHS3 Compliant, Active.

$10.22Ref. price · indicative, final on quote
NXP Semiconductors MC33FS6502LAE datasheet (PDF)
Packaging48-LQFP Exposed Pad
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MC33FS6502LAE specifications
ParameterValue
MountingSurface Mount
Supply voltage1V ~ 5V
Operating temperature-40°C ~ 125°C
PackageTray
ApplicationsSystem Basis Chip
Case48-LQFP Exposed Pad

Product details

What the MC33FS6502LAE does in the assembly

The NXP MC33FS6502LAE is a System Basis Chip (SBC) that integrates a DC-DC converter rated for 0.8 A and a voltage regulator (VCO) into a single 48-LQFP Exposed Pad package. It is designed to serve as the power-management and control hub in automotive and industrial electronic control units, combining supply regulation, communication interface, and system monitoring functions.

The MC33FS6502LAE comes in a 48-LQFP with an exposed pad (supplier device package 48-HLQFP, 7x7 mm). Without proper via stitching under the pad, junction temperature can rise quickly under continuous 0.8 A load.

Frequently asked questions

Is MC33FS6502LAE equivalent to MC33FS6500?

The MC33FS6502LAE and MC33FS6500 are both System Basis Chips from NXP within the same FS65 family, but the evidence does not confirm pin-to-pin equivalence or identical feature sets. Verify the specific variant differences (output current, feature options) against the datasheet before substituting.