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NXP Semiconductors BUK754R0-55B,127 — Discrete Semiconductors

NXP BUK754R0-55B,127 N-Channel TrenchMOS MOSFET, 55V, 75A

MPNBUK754R0-55B,127
End of Life

NXP TrenchMOS™ N-channel MOSFET, BUK754R0-55B,127, 55V Vdss, 75A Id, 4mOhm Rds(on) at 10V gate drive, TO-220AB through-hole package, -55°C to 175°C junction temperature.

$0.71Ref. price · indicative, final on quote
PackagingTO-220-3
RoHSROHS3 Compliant
SeriesTrenchMOS™
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

BUK754R0-55B,127 specifications
ParameterValue
SeriesTrenchMOS™
FET typeN-Channel
MountingThrough Hole
Drain to source voltage55 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C75A (Tc)
Power dissipation300W (Tc)
Operating temperature-55°C ~ 175°C (TJ)
PackageTube
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3
Vgs(th) (Max) @ id4V @ 1mA
Rds on (Max) @ id, vgs4mOhm @ 25A, 10V
Gate charge (Qg) (Max) @ vgs86 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds6776 pF @ 25 V

Product details

What this TrenchMOS N-channel does in your power stage

The NXP BUK754R0-55B,127 is a TrenchMOS N-channel MOSFET designed for low-loss switching in 48 V power rails, motor drives, and DC-DC converters. The 55 V drain-source rating provides headroom for 48 V nominal systems with derating for transients.

Key ratings that drive the BOM decision

At 25 A the device dissipates only 2.5 W conduction loss, which the 300 W package-rated power dissipation can handle with adequate thermal management. Input capacitance of 6776 pF at 25 V drain-source affects switching speed and driver losses. At 100 kHz the capacitive switching loss in the driver is roughly 0.5 * Ciss * Vgs^2 * f = 0.5 * 6776 pF * (10 V)^2 * 100 kHz = 3.4 mW, negligible. The real impact is on rise/fall times: a 2 A driver charges Ciss in about 34 ns. Derating the 75 A continuous current above 100°C case temperature is mandatory per the datasheet's power derating curve.

Package and mounting for the board

Housed in a TO-220AB through-hole package, this MOSFET mounts into a standard TO-220 footprint on a PCB or heatsink. The metal tab is the drain connection and must be electrically isolated or connected to the drain node. Through-hole assembly is straightforward for rework and prototyping, though the large tab needs a heatsink for continuous operation above a few tens of amps.

Frequently asked questions

What is the BUK754R0-55B datasheet and specifications?

Engineers need full electrical specs to validate fit in their design.

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What is the price for BUK754R0-55B?

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Is BUK754R0-55B RoHS compliant?

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What is the BUK754R0-55B pinout?

Design engineers need pin mapping for PCB layout and compatibility checking.

Is there an equivalent or replacement for BUK754R0-55B?

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