Package and mounting — SOT-502B
SOT-502B is the industry-standard earless flanged ceramic package for RF power LDMOS in this power class. The flange face provides the drain and source contact through the mounting surface; the gate and drain leads are on the top edge. Torque the mounting screws to the manufacturer's specification for thermal resistance — the package is designed for direct conduction to a heatsink, not free-air convection. No isolation washer needed if the heatsink is at ground potential.
The RoHS compliance covers the full device, including the lead-free solder plating on the leads.