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NXP Semiconductors 74ALVCH16843DGGY — Microcontrollers & Processors (MCU / MPU / DSP)

74ALVCH16843DGGY NXP 18-bit transparent latch, 2.3-3.6V

MPN74ALVCH16843DGGY
End of Life

NXP 74ALVCH, D-Type Transparent Latch, 74ALVCH16843DGGY, 18-bit bus-interface, 2.3V-3.6V supply, 2.2ns propagation delay, 24mA output drive, 56-TSSOP.

$0.66Ref. price · indicative, final on quote
Packaging56-TFSOP (0.240", 6.10mm Width)
StockIn Stock (20)
Lead timeIn Stock wk
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

74ALVCH16843DGGY Technical Specifications
ParameterValue
Series74ALVCH
Logic typeD-Type Transparent Latch
Output typeTri-State
Mounting typeSurface Mount
Voltage2.3V ~ 3.6V
Current - output high, low24mA, 24mA
Operating temperature-40°C ~ 85°C
Circuit9:9
PackageBulk
Case56-TFSOP (0.240\", 6.10mm Width)
Independent circuits2
Delay time - propagation2.2ns

Product details

18-bit bus-interface latch — parametric fit

The 74ALVCH16843DGGY: Two independent 9-bit latches per package (circuit 9:9) give the board designer a single-device solution for 18-bit bus-interface or register applications where the latch is transparent when the enable is asserted. With a 2.2 ns typical propagation delay and 24 mA symmetrical output drive (high and low), this latch keeps up with fast memory and processor buses without adding a timing margin penalty.

Package and board-level integration

Supplied in a 56-TFSOP (0.240", 6.10 mm width) package, also designated as 56-TSSOP by NXP — the 0.50 mm pitch footprint demands careful PCB layout for fan-out and decoupling placement.

Frequently asked questions

What package does 74ALVCH16843DGGY come in?

It is supplied in a 56-TFSOP (0.240", 6.10 mm width) package, also referred to as 56-TSSOP by NXP. The 0.50 mm pitch requires a 4-layer board for reliable fan-out.