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NXP USA Inc. MK20DX32VMP5 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP MK20DX32VMP5 MCU — Kinetis K20, 50MHz, 32KB Flash, USB OTG, 64-LFBGA

MPNMK20DX32VMP5
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NXP Kinetis K20, MK20DX32VMP5, ARM Cortex-M4 50MHz, 32KB flash, 8KB RAM, 2KB EEPROM, 13x16b A/D, USB OTG / UART / SPI / I²C, 40 I/O, 1.71–3.6V supply, -40°C to 105°C, 64-LFBGA (5x5 mm) tray.

$10.5200Ref. price · indicative, final on quote
Packaging64-LFBGA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MK20DX32VMP5 Technical Specifications
ParameterValue
SeriesKinetis K20
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.71V ~ 3.6V
Operating temperature-40°C~105°C(TA)
Speed50MHz
PackageTray
RAM size8K x 8
Core size32-Bit Single-Core
EEPROM size2K x 8
PeripheralsDMA, I²S, LVD, POR, PWM, WDT
ConnectivityI²C, IrDA, SPI, UART/USART, USB, USB OTG
Number of i (O)40
Core processorARM® Cortex®-M4
Case64-LFBGA
Data convertersA/D 13x16b
Program memory size32KB (32K x 8)

Frequently asked questions

Is there a pin-compatible variant with more flash for a memory upgrade or respin?

The MK20DX128VLH5 carries 128KB flash and 16KB RAM in an LQFP-44 package — it is not a pin-compatible drop-in because the package format differs (BGA versus QFP). A board respin would be required. The base product number MK20DX32 is shared, but memory density and I/O count differ materially from the 128KB variants.

What is the thermal derating guidance for a sealed industrial enclosure?

The part is rated -40°C to 105°C ambient. In a sealed enclosure running at 50MHz full load with limited airflow, I/O pin current should be conservatively derated (50–70% of rated maximum per pin is standard practice until the board thermal profile is characterised). Consult the junction-to-ambient thermal resistance values for the 64-MAPBGA package on the NXP datasheet to calculate the actual margin for your specific board stack-up.