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NXP USA Inc. LPC3240FET296015 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC3240FET296015 ARM926EJ-S MCU, 266 MHz, 256 KB SRAM

MPNLPC3240FET296015
Active

NXP LPC3200 series ARM926EJ-S microcontroller, LPC3240FET296015, 266 MHz core, 256K x 8 SRAM, ROMless, 51 I/O, Ethernet, USB OTG, 296-TFBGA (15x15 mm), -40°C to 85°C, active.

$21.2900Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC3240FET296015 specifications
ParameterValue
SeriesLPC3200
MountingSurface Mount
Oscillator typeInternal
Program memory typeROMless
Voltage - supply (Vcc (Vdd))0.9V ~ 3.6V
Operating temperature-40°C~85°C(TA)
Speed266MHz
PackageBulk
RAM size256K x 8
Core size16/32-Bit
PeripheralsDMA, I²S, Motor Control PWM, PWM, WDT
ConnectivityEBI/EMI, Ethernet, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Number of i (O)51
Core processorARM926EJ-S
Case296-TFBGA
Data convertersA/D 3x10b

Product details

The NXP LPC3240FET296015 is an ARM926EJ-S microcontroller running at 266 MHz, built for applications that need a balance of processing throughput and peripheral integration. It carries 256K x 8 SRAM on-chip but no internal flash — program storage lives in external memory via the EBI/EMI interface. The part is aimed at industrial control, networked gateways, and human-machine interfaces where Ethernet and USB OTG connectivity are required.

The 266 MHz ARM926EJ-S core gives this MCU enough headroom to run a lightweight OS (e.g., FreeRTOS or a small Linux build) while handling Ethernet packet processing and USB host/device traffic. The 256 KB SRAM is the working memory for code and data — it is not huge, so external SDRAM or SRAM is typical for frame buffers or larger heaps. ROMless program memory means the BOM must include a serial NOR or NAND flash, adding a few cents but giving flexibility in firmware size and field updates. The 51 GPIOs, plus dedicated I²C, SPI, UART, and I²S interfaces, cover most sensor and actuator connections without external muxing.

Package and rework reality

The 296-ball TFBGA (15x15 mm) is a fine-pitch BGA. This is not a hand-solder part; rework requires a hot-air station with a preheat plate, a stencil for fresh solder balls, and X-ray inspection to verify joint integrity.

Frequently asked questions

What is the core speed of the LPC3240FET296015?

The ARM926EJ-S core runs at 266 MHz, which is the listed maximum operating frequency.

What package does the LPC3240FET296015 use?

It comes in a 296-ball TFBGA (15x15 mm) surface-mount package. The fine-pitch BGA requires rework with hot air and X-ray inspection.