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NXP USA Inc. LPC1837FET256,551 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC1837FET256,551 ARM Cortex-M3 MCU, 150 MHz, 1 MB Flash

MPNLPC1837FET256,551
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NXP LPC18xx series 32-bit ARM Cortex-M3 MCU, LPC1837FET256,551, 150 MHz, 1 MB Flash, 136K x 8 RAM, 80 I/O, 256-LBGA, -40°C to 85°C.

$19.7300Ref. price · indicative, final on quote
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Specifications

LPC1837FET256,551 Technical Specifications
ParameterValue
SeriesLPC18xx
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed150MHz
PackageTray
RAM size136K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, Microwire, SD, SPI, SSI, SSP, UART/USART, USB OTG
Number of i (O)80
Core processorARM® Cortex®-M3
Case256-LBGA
Data convertersA/D 16x10b; D/A 1x10b
Program memory size1MB (1M x 8)

Product details

What this MCU brings to the BOM

The NXP LPC1837FET256,551 is a 32-bit ARM Cortex-M3 microcontroller running at 150 MHz, with 1 MB of on-chip Flash and 136K x 8 of SRAM. It targets industrial control, motor-drive, and communication-gateway applications where a single-chip MCU must handle both real-time loops and protocol stacks like Ethernet, CAN, and USB OTG without an external host processor. The 80 general-purpose I/O lines and the internal oscillator keep the external BOM lean — no crystal needed for basic operation, and the 256-LBGA (17x17 mm) package fits a four-layer board without heroic routing. Supply range of 2 V to 3.6 V.

150 MHz Cortex-M3 — what it means for throughput

At 150 MHz the Cortex-M3 delivers 150 MHz clock speed. The DMA engine offloads peripheral transfers.

Memory sizing and field-update reality

1 MB of Flash holds a full firmware image plus a fallback bootloader for over-the-air or fieldbus-driven updates. The 136K x 8 SRAM leaves room for a TCP/IP buffer pool and a few kilobytes of real-time data without needing external RAM. If your application needs more than 136 KB of working memory, plan for an external SDRAM or SRAM on the EBI/EMI bus — the LPC1837 supports that directly.

Connectivity and peripheral set

The part integrates CAN, Ethernet, USB OTG, multiple I²C and SPI/SSP ports, plus a Motor Control PWM block with dead-time insertion. That means one MCU can act as a fieldbus gateway, a servo drive controller, and a data-logging node. The 16-channel 10-bit ADC and single 10-bit DAC handle analog feedback from current sensors or potentiometers.

Temperature grade and environment

Rated for -40°C to 85°C ambient. The 256-LBGA package is a standard ball-grid array.

Lifecycle and sourcing posture

The LPC1837FET256,551 carries an Active lifecycle status from NXP. No last-time-buy or EOL notice is on record. For BOM-freeze planning, this part is a safe choice for new designs and long-run production. Sourced and quoted to order against an RFQ through independent distribution; availability and current pricing confirmed at quote time.

Frequently asked questions

What is the operating temperature range of LPC1837FET256?

The LPC1837FET256,551 is rated for -40°C to 85°C ambient, covering industrial and outdoor telecom environments.

What are alternatives to LPC1837FET256?

Within the LPC18xx series, pin-compatible variants differ in Flash and RAM density. The LPC1837FET256,551 sits at the 1 MB Flash / 136K x 8 RAM tier; lower-density siblings share the same 256-LBGA footprint and peripheral set for cost-down or upgrade paths.