180 MHz Cortex-M3 with a full connectivity set
The LPC1830FET256,551: This part is suited for industrial control, motor-drive communication gateways, and multi-protocol bridge designs where the processing headroom of 180 MHz handles protocol stacks (Ethernet, CANopen, Modbus TCP) alongside real-time control loops. The 164 general-purpose I/O lines in a 256-LBGA (17x17 mm) package give ample room for parallel displays, memory buses, and sensor arrays.
ROMless design — plan for external Flash
Temperature grade and environment
Rated for the industrial temperature range of -40 °C to 85 °C, the LPC1830FET256,551 is at home in factory automation, outdoor telecom cabinets, and motor-drive enclosures where ambient temperature swings are the norm. The 256-LBGA package (17x17 mm) is a fine-pitch BGA — board assembly requires a solder-paste stencil and reflow profile typical of BGA components, not hand-solderable. Verify the PCB land pattern against the supplier device package drawing before layout.
Active lifecycle and sourcing
The LPC1830FET256,551 is listed as Active in production status. It is sourced and quoted to order against an RFQ through independent distribution; availability and current pricing are confirmed at quote time. For volume production or a BOM line that needs a second source, the LPC18xx family includes multiple density and package variants that share the same Cortex-M3 core and peripheral set — review the NXP LPC18xx selector guide for pin-compatible options with on-chip Flash if the external-memory approach is not preferred.