Skip to main content
NXP USA Inc. LPC1830FET100,551 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC1830FET100,551 ARM Cortex-M3 MCU, 180MHz, 200K x 8 RAM, 100-TFBGA

MPNLPC1830FET100,551
Active

NXP LPC18xx series 32-bit ARM Cortex-M3 MCU, LPC1830FET100,551, 180MHz core, 200K x 8 RAM, ROMless, 100-TFBGA package, -40°C to 85°C operating temperature, 2.2V to 3.6V supply.

$12.7200Ref. price · indicative, final on quote
Packaging100-TFBGA
RoHSROHS3 Compliant
SeriesLPC18xx
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC1830FET100,551 specifications
ParameterValue
SeriesLPC18xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeROMless
Voltage - supply (Vcc (Vdd))2.2V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed180MHz
PackageTray
RAM size200K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG
Number of i (O)49
Core processorARM® Cortex®-M3
Case100-TFBGA
Data convertersA/D 8x10b; D/A 1x10b

Product details

The 180 MHz core speed is the headline performance figure here. The external memory interface and DMA controller need to keep up — the EBI/EMI is there for a reason.

Connectivity and I/O count

With 49 I/O lines and a connectivity list that covers Ethernet, dual USB (host/OTG), CAN, multiple SPI/SSP/I²C, and an external memory bus, this MCU can serve as the central node in a distributed control system. The 100-TFBGA package (9x9 mm) keeps the footprint compact, but routing the BGA on a two-layer board is tight — a four-layer stack with a solid ground plane is the practical minimum for signal integrity on the Ethernet and EBI lines.

Frequently asked questions

Does LPC1830FET100,551 have internal flash memory?

No, the LPC1830FET100,551 is ROMless — it has no internal program memory. All code must be stored in an external Flash device connected via the EBI/EMI or SPI/SSP interfaces.

What is the package for LPC1830FET100?

The LPC1830FET100,551 is supplied in a 100-TFBGA package (100-ball thin fine-pitch ball grid array, 9x9 mm body).