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NXP USA Inc. LPC1316FHN33,551 — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC1316FHN33,551 ARM Cortex-M3 MCU, 72 MHz, 48 KB Flash, 32-HVQFN

MPNLPC1316FHN33,551
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NXP LPC13xx series, ARM Cortex-M3 32-bit MCU, 72 MHz, 48 KB Flash, 8K x 8 RAM, 4K x 8 EEPROM, 26 I/O, I²C/SPI/UART, 8x12-bit ADC, 2V to 3.6V, -40°C to 85°C, 32-HVQFN exposed pad, Tray.

$6.9300Ref. price · indicative, final on quote
NXP USA Inc. LPC1316FHN33,551 datasheet (PDF)
Packaging32-VQFN Exposed Pad
RoHSROHS3 Compliant
SeriesLPC13xx
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Jul 2026

Specifications

LPC1316FHN33,551 specifications
ParameterValue
SeriesLPC13xx
MountingSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))2V ~ 3.6V
Operating temperature-40°C ~ 85°C (TA)
Speed72MHz
PackageTray
RAM size8K x 8
Core size32-Bit Single-Core
EEPROM size4K x 8
PeripheralsBrown-out Detect/Reset, POR, WDT
ConnectivityI²C, Microwire, SPI, SSI, SSP, UART/USART
Number of i (O)26
Core processorARM® Cortex®-M3
Case32-VQFN Exposed Pad
Data convertersA/D 8x12b
Program memory size48KB (48K x 8)

Product details

Industrial temperature and package fit

The LPC1316FHN33,551: Rated for -40°C to 85°C ambient, this MCU is at home in outdoor telecom cabinets, factory-floor controllers, and engine-bay-adjacent enclosures. The 32-HVQFN (7x7 mm) with exposed pad needs a thermal via pattern under the centre pad if the design draws more than a few hundred milliamps continuously — the datasheet's recommended footprint is the one to follow. Surface-mount only; no through-hole variant exists.

Connectivity and peripherals

The I²C, SPI, SSI, SSP, and UART/USART blocks cover most on-board serial buses. Microwire compatibility is listed. The internal oscillator eliminates an external crystal for non-precision timing.

Frequently asked questions

What are the specifications of LPC1316FHN33?

The LPC1316FHN33,551 is a 32-bit ARM Cortex-M3 MCU with a 72 MHz core, 48 KB Flash, 8 KB RAM, 4 KB EEPROM, 26 I/O, 8x12-bit ADC, I²C/SPI/UART connectivity, operating from 2 V to 3.6 V over -40°C to 85°C in a 32-HVQFN package.

What is the pinout of LPC1316FHN33?

The pinout is defined in the NXP LPC1316 datasheet. The 32-HVQFN package has 26 I/O pins plus power, ground, and the exposed pad (which must be connected to ground for thermal and electrical performance).