NXP LPC11U24FHN33/401, ARM Cortex-M0 32-bit MCU, 50 MHz, 32 KB Flash, 10 KB RAM, USB 2.0, I²C/SPI/UART, -40 to 85 °C, 32-HVQFN Exposed Pad.
| Parameter | Value |
|---|---|
| Series | LPC11Uxx |
| Mounting | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C ~ 85°C (TA) |
| Speed | 50MHz |
| Package | Tray |
| RAM size | 10K x 8 |
| Core size | 32-Bit Single-Core |
| EEPROM size | 4K x 8 |
| Peripherals | Brown-out Detect/Reset, POR, WDT |
| Connectivity | I²C, Microwire, SPI, SSI, SSP, UART/USART, USB |
| Number of i (O) | 26 |
| Core processor | ARM® Cortex®-M0 |
| Case | 32-VQFN Exposed Pad |
| Data converters | A/D 8x10b |
| Program memory size | 32KB (32K x 8) |
50 MHz on a single-cycle Cortex-M0 delivers roughly 50 DMIPS. The 10 KB RAM must hold USB endpoint buffers, a stack for the main loop, and intermediate data buffers.
The 32-HVQFN package (7x7 mm body) has an exposed thermal pad on the bottom. The pad must be soldered to a PCB ground plane for thermal relief and electrical ground connection.
This part is sourced through independent distribution. It is quoted to order against an RFQ; availability and current pricing are confirmed at quote time.
The LPC11Uxx series includes several Flash/RAM density options in the same 32-HVQFN footprint. A designer can move to a higher-density sibling (e.g., 64 KB Flash / 12 KB RAM) without a board layout change, as the pinout and package are shared across the family.
The core runs at 50 MHz, which on a single-cycle Cortex-M0 delivers roughly 50 DMIPS.
The part is ROHS3 compliant. No REACH, UL, or IEC documentation is listed in the available records.