Micron Technology MT52L256M32D1PF-107 WT:B TR — Crystals & Oscillators
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Micron MT52L256M32D1PF-107 WT:B TR LPDDR3 SDRAM, 8 Gbit

MPN MT52L256M32D1PF-107 WT:B TR
End of Life Spot Stock · 24-48h Dispatch 100% Original Sealed

Micron MT52L256M32D1PF-107 WT:B TR, LPDDR3 SDRAM, 8 Gbit (256M x 32), 933 MHz, 1.2 V, 178-VFBGA, -30°C to 85°C.

In Stock: 3,441 pcs
MOQ: 1 pcs
Logistics: DHL / FedEx DAP (Global Express · 3-7d) Russia & CIS DDP (Door-to-Door Cleared)
Dispatch: Shenzhen / HK
Unit Price (USD)
$16.78 / pc
Direct Purchase Ready
Volume Pricing Breaks Confirmed upon quotation
1+ pcs
$16.78
10+ pcs
$15.10
30+ pcs
$13.76
100+ pcs
$12.42
500+ pcs
$11.58
1,000+ pcs
$10.91
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$16.78 / ea

3,441 in stock — maximum per order · 3–4 days lead time

$15.10 / ea from 10 pcs

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[SPEC] Essential Parameters Snapshot Full Specifications (11)
Package / Case 178-VFBGA
Supply Voltage 1.2V
Speed / Frequency 933 MHz
Memory / RAM 8Gbit

Full Technical Specifications

11 Parameters
MT52L256M32D1PF-107 WT:B TR specifications
Parameter / AttributeSpecification / Value
Memory typeVolatile
MountingSurface Mount
Supply voltage1.2V
Clock frequency933 MHz
Operating temperature-30°C ~ 85°C (TC)
PackageTape & Reel (TR); Cut Tape (CT)
TechnologySDRAM - Mobile LPDDR3
Memory size8Gbit
Memory formatDRAM
Case178-VFBGA
Memory organization256M x 32
[DESK] Shenzhen Spot Allocation · 2h Response

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Factory lead times blocking production? We lock verified brand-new original stock in Shenzhen within 2 hours.

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[01] Emergency Shortage 24-48h Shenzhen Dispatch

Direct access to Shenzhen floor inventory, franchised allocation buffers, and factory bonded stock to resolve line-down shutdowns.

[02] Industrial Packaging Tape & Reel / Tray / Tube

Standard factory-sealed packaging compliant with EIA-481 standards for automated high-speed SMT pick-and-place lines.

[03] WhatsApp QC Proof 45x Microscope QC Photos

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Technical Details & Description

8 Gbit LPDDR3 for mobile and embedded memory subsystems

The Micron MT52L256M32D1PF-107 WT:B TR is an 8 Gbit LPDDR3 SDRAM organized as 256M x 32, clocked at 933 MHz, in a 178-VFBGA package. This is a mobile-class DRAM intended for smartphones, tablets, portable media, and embedded systems that require high bandwidth in a compact footprint.

Packaging: Tape & Reel for volume assembly

This variant ships in Tape & Reel (TR) and is also available as Cut Tape (CT). The 178-VFBGA (11.5x11 mm) footprint is standard for LPDDR3 in mobile SoM and tablet PCBs. The TR suffix is the only difference from the Tray-packaged MT52L256M32D1PF-107 WT:B — same die, same timing, same footprint. For reel-fed pick-and-place lines, the TR variant avoids a tray-handling step.

Frequently asked questions

What is the difference between MT52L256M32D1PF-107 WT:B TR and MT52L256M32D1PF-107 WT:B?

The only difference is packaging: the TR suffix indicates Tape & Reel, while the base MPN without TR ships in Tray. The die, density, speed grade, and footprint are identical.

What are the specifications of MT52L256M32D1PF-107?

It is an 8 Gbit LPDDR3 SDRAM organized as 256M x 32, clocked at 933 MHz, operating from a 1.2 V supply, in a 178-VFBGA package, rated -30°C to 85°C.

Is MT52L256M32D1PF-107 compatible with all LPDDR3 controllers?

It follows the JEDEC LPDDR3 standard and is compatible with any LPDDR3 memory controller that supports 1.2 V I/O and 933 MHz (1866 MT/s) timing. Verify the controller's maximum supported density and x32 bus width — some controllers cap at 4 Gbit or x16.

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