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Microchip Technology MIC23030-GYMT-TR — Discrete Semiconductors

MIC23030-GYMT-TR Buck Regulator, 400mA, 8MHz, 6-TMLF

MPNMIC23030-GYMT-TR
End of Life

Microchip Technology HyperLight Load® series, Step-Down Buck Regulator, MIC23030-GYMT-TR, Fixed 1.8V Output, 400mA, 8MHz, 6-TMLF® (1.6x1.6) Surface Mount, Tape & Reel.

$1.02Ref. price · indicative, final on quote
Packaging6-UFDFN Exposed Pad, 6-TMLF®
RoHSROHS3 Compliant
SeriesHyperLight Load®
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

MIC23030-GYMT-TR specifications
ParameterValue
SeriesHyperLight Load®
Output typeFixed
MountingSurface Mount
Voltage - input5.5V
Voltage - output (Min (Fixed))1.8V
Output current400mA
Frequency - switching8MHz
I/O channels1
Operating temperature-40°C ~ 125°C (TJ)
PackageTape & Reel (TR); Cut Tape (CT)
FunctionStep-Down
TopologyBuck
Case6-UFDFN Exposed Pad, 6-TMLF®
Output configurationPositive
Synchronous rectifierYes

Product details

400 mA, 8 MHz — the switching frequency drives the inductor choice

The MIC23030-GYMT-TR: Switching at 8 MHz, the part lets you use a physically small inductor — typically 0.47 µH to 1 µH — which keeps the total solution footprint tight for space-constrained boards. The synchronous rectifier eliminates the external Schottky diode, so the BOM stays lean and the efficiency curve holds up across light to moderate loads.

A 2-layer board with a via array under the pad works for 400 mA; a 4-layer board gives more thermal margin. The fixed 1.8 V output means no feedback divider resistors on the board — just the inductor, input/output caps, and the part itself. That cuts two resistors and a potential noise pickup point from the layout.

Active lifecycle and compliance — no end-of-life risk for new designs

RoHS3 compliant with no exemptions — the part ships on tape and reel and meets the EU directive for lead-free soldering processes.

Frequently asked questions

Can I hand-solder the 6-TMLF package?

Yes — the 1.6 mm × 1.6 mm TMLF package has an exposed pad but the pitch is wide enough for a fine-tip iron and hot-air rework station. A stencil for the pad is recommended for consistent solder paste volume under the centre paddle.