Microchip DSC1223CI3-429M5000T, XO (Standard) with MEMS base resonator, LVDS output at 429.5 MHz, ±20 ppm stability, 2.5V–3.3V supply, -40 to 85°C, 6-VDFN package.
| Parameter | Value |
|---|---|
| Type | XO (Standard) |
| Series | DSC1223 |
| Mounting | Surface Mount |
| Supply voltage | 2.5V ~ 3.3V |
| Current - supply | 32mA (Typ) |
| Current - supply (Disable) | 23mA (Typ) |
| Frequency | 429.5 MHz |
| Frequency stability | ±20ppm |
| Operating temperature | -40°C ~ 85°C |
| Size (Dimension) | 0.126\" L x 0.098\" W (3.20mm x 2.50mm) |
| Height - seated | 0.035\" (0.90mm) |
| Output | LVDS |
| Package | Tape & Reel (TR) |
| Function | Enable/Disable |
| Base resonator | MEMS |
| Case | 6-VDFN |
Housed in a 6-VDFN package measuring 3.20 mm x 2.50 mm with a seated height of 0.90 mm — a compact footprint that fits tight optical-module or switch-fabric layouts. Store the reels dry — the VDFN package is moisture-sensitive per JEDEC MSL; confirm the floor life before reflow.
The DSC1223CI2 suffix typically indicates a different stability or temperature grade. The CI3 variant here is ±20 ppm over -40 to 85°C. Confirm the CI2 datasheet — the two may not be drop-in equivalents if the CI2 uses a wider stability or narrower temp range.
The 6-VDFN package measures 3.20 mm x 2.50 mm with a 0.90 mm seated height. The recommended land pattern is in the datasheet — the centre pad may be a thermal or ground paddle; verify the solder-paste stencil aperture for void-free reflow.