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Microchip Technology 1N6169AUS — Circuit Protection

1N6169AUS Zener TVS Diode – 1500W SQ-MELF, Active Production

MPN1N6169AUS
Active

Microchip Technology 1N6169AUS, bidirectional Zener TVS diode, 1500 W peak pulse power, 98.8 V reverse standoff, SQ-MELF C package, surface mount, -55°C to 175°C junction temperature range.

$22.8900Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

1N6169AUS specifications
ParameterValue
TypeZener
MountingSurface Mount
Voltage - breakdown123.5V
Voltage - clamping (Max) @ ipp178.8V
Voltage - reverse standoff98.8V
Current - peak pulse (10/1000μs)8.4A
Power - peak pulse1500W (1.5kW)
Power line protectionNo
Operating temperature-55°C~175°C(TJ)
PackageBulk
ApplicationsGeneral Purpose
CaseSQ-MELF, C
Bidirectional channels1

Product details

The 1N6169AUS is a bidirectional Zener TVS diode from Microchip Technology, rated for 1500 W (1.5 kW) peak pulse power under the 10/1000 µs waveform. That power rating, combined with a hermetic SQ-MELF C package, makes it a candidate for high-reliability circuit protection in avionics, defense, and industrial power supplies where transient energy must be clamped without package failure.

98.8 V standoff, 178.8 V clamp — the protection window

The reverse standoff voltage is 98.8 V typical, meaning the diode draws negligible leakage below that rail. Breakdown starts at 123.5 V minimum, and the clamping voltage peaks at 178.8 V at the rated peak pulse current of 8.4 A. For a 100 V DC bus or a 120 V AC line, this window keeps the protected circuit below destructive overvoltage while avoiding nuisance conduction during normal operation.

Active production, hermetic package for harsh environments

The SQ-MELF C package is a hermetic ceramic surface-mount form factor, suited for high-reliability programs requiring MIL-STD screening.

Bidirectional single-channel protection

The SQ-MELF footprint is compatible with standard surface-mount assembly processes, though the hermetic body may require reflow profile adjustments compared to plastic packages.