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Microchip Technology 1N6109US — Circuit Protection

1N6109US Zener TVS Diode - Microchip, 500W, SQ-MELF

MPN1N6109US
Active

Microchip Technology 1N6109US, Zener TVS diode, 500 W peak pulse power, 9.9 V reverse standoff, 19.11 V clamping, bidirectional, SQ-MELF surface-mount package.

$15.2400Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

1N6109US Technical Specifications
ParameterValue
TypeZener
Mounting typeSurface Mount
Voltage - breakdown11.73V
Voltage - clamping (Max) @ ipp19.11V
Voltage - reverse standoff9.9V
Current - peak pulse (10/1000μs)26.13A
Power - peak pulse500W
Power line protectionNo
Operating temperature-55°C~175°C(TJ)
PackageBulk
ApplicationsGeneral Purpose
CaseSQ-MELF, B
Bidirectional channels1

Product details

500 W Zener TVS in SQ-MELF — transient protection for general-purpose rails

The 1N6109US: The 9.9 V reverse standoff voltage protects a 12 V rail, clamping transients at 19.11 V max while handling 26.13 A peak pulse current. The SQ-MELF (B, DO-213AB) package is a hermetic glass body suited for surface-mount assembly — the metalized end caps reflow directly to the PCB pad, no leads to bend.

Clamp voltage and peak current — the surge budget

At 26.13 A peak pulse current the diode clamps at 19.11 V max. For a 12 V nominal rail, that clamp margin (~7 V above standoff) means downstream components need a 20 V minimum breakdown rating to stay inside the safe operating area. The 500 W rating is the product of clamp voltage and peak current — derate above 25 °C per the datasheet curve.

Active production — no LTB pressure

Microchip lists the 1N6109US as Active. The SQ-MELF package is a standard Microchip TVS platform — same footprint as the 1N61xxUS family, so a BOM change to a different voltage variant (e.g., 1N6108US, 1N6110US) requires only a reel swap, not a board respin.

SQ-MELF footprint — layout checklist

The SQ-MELF (B, DO-213AB) is a two-terminal end-cap package. PCB land pattern: rectangular pads matching the metallized band width — typically 0.060″ × 0.100″ per end with a 0.100″ gap. Reflow profile follows standard SnAgCu solder; the hermetic glass body handles 175 °C junction temperature without moisture sensitivity concerns. No MSL classification — the glass seal is impervious to humidity.

Frequently asked questions

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