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KYOCERA AVX TPSA335M016H3500 — Specialty Capacitors

TPSA335M016H3500 KYOCERA AVX Molded Tantalum Capacitor 3.3

MPNTPSA335M016H3500
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KYOCERA AVX TPS series, Molded tantalum capacitor, 3.3 µF ±20%, 16 V rated, 3.5 Ohm ESR, 1206 (3216 Metric) surface-mount package, -55°C to +125°C operating range.

$0.6622Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TPSA335M016H3500 specifications
ParameterValue
TypeMolded
SeriesTPS
MountingSurface Mount
ESR3.5Ohm
Voltage - rated16 V
Operating temperature-55°C~125°C
Size (Dimension)0.126\" L x 0.063\" W (3.20mm x 1.60mm)
Height - seated0.071\" (1.80mm)
PackageTape & Reel (TR)
FeaturesGeneral Purpose
Tolerance±20%
Capacitance3.3 µF
Case1206 (3216 Metric)
Manufacturer size codeA

Product details

Molded tantalum for harsh-temperature designs

At 3.3 µF and 16 V with ±20% tolerance, it suits bulk decoupling on a 5 V or 12 V rail, or as a filter capacitor in a DC-DC converter output stage where the voltage margin stays above 50 % of the rated voltage — a standard derating practice for tantalum capacitors to avoid surge failures.

ESR and ripple current budget

The 3.5 Ohm ESR at 25°C sets the self-heating under ripple current: for a given ripple current I, the internal power dissipation is I² × 3.5 Ohm. On a 12 V input rail with 100 mA ripple, the temperature rise is roughly 35 mW — negligible for the 1206 case, but on a high-ripple output the ESR limits the allowable AC current before the capacitor exceeds its rated temperature. Tantalum capacitors have a voltage derating guideline of 50 % for reliable operation; at 16 V rated, the recommended working voltage is 8 V or less. Staying below that threshold avoids the risk of field failures from voltage surges or high inrush currents.

1206 footprint and reflow compatibility

The 1206 (3216 Metric) case measures 0.126" × 0.063" (3.20 mm × 1.60 mm) with a seated height of 0.071" (1.80 mm). This is a standard two-terminal chip footprint compatible with most pick-and-place machines and reflow profiles for lead-free solder. The molded construction provides mechanical robustness and moisture resistance, suitable for conformal-coated boards in humid or condensing environments.

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