Molded tantalum for wide-temperature decoupling
Its 1.3 Ohm ESR at 100 kHz sets the ripple current handling and the self-heating limit — for a given ripple current, the internal temperature rise is I² × ESR, so a 500 mA ripple adds about 0.33 W of dissipation inside the package. The molded epoxy case provides mechanical stability across thermal cycling without the moisture sensitivity of uncoated chips.
Surface-mount footprint and board fit
Housed in a 2312 (6032 Metric) case with manufacturer size code W, the part measures 6.00 mm × 3.20 mm with a seated height of 1.50 mm max. The low profile suits tight board-stacking constraints — a 1.5 mm clearance above the component is enough for most conformal-coat or potting processes. Supplied on tape and reel, the part is pick-and-place ready for reflow soldering. The molded body is compatible with standard lead-free profiles; no special bake-out is required for this package type before assembly.