Molded tantalum for wide-temp decoupling
The molded case construction provides consistent dimensional control and solder joint reliability across reflow profiles.
Package fit and footprint
Surface mount in a 2312 (6032 Metric) case, size code W, with dimensions 6.00 mm x 3.20 mm and a seated height of 1.50 mm. The low profile suits height-constrained PCB stacks in portable or sealed assemblies.
