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Infineon Technologies S70GL02GS12FHIV20 — Memory (DRAM / SRAM / Flash / EEPROM)

Infineon S70GL02GS12FHIV20 2 Gbit Parallel NOR Flash, 120 ns

MPNS70GL02GS12FHIV20
Active

Infineon GL-S series S70GL02GS12FHIV20, 2 Gbit Parallel NOR Flash, 128M x 16 organization, 120 ns access time, 1.65 V supply, -40°C to 85°C, PBGA-64, Tray.

$27.27Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

S70GL02GS12FHIV20 Technical Specifications
ParameterValue
SeriesGL-S
Interface_typeParallel
Mounting_typeSurface Mount
Operating temperature high-40°C to 85°C (TA)
Frame_size2Gbit
Access time120 ns
Memory_typeNon-Volatile
Package_typeTray
Memory formatFLASH
Product_statusActive
Supply_voltage_v1.65
Memory organization128M x 16

Product details

2 Gbit parallel NOR flash for code-shadowing and data logging

The Infineon S70GL02GS12FHIV20 is a 2 Gbit parallel NOR flash memory from the GL-S series, organized as 128M x 16 bits. This part is designed for embedded systems that need fast, random-access read performance for direct code execution (XIP) or high-reliability data logging in industrial, telecom, and automotive cabin-domain applications.

The 120 ns access time sets the read-cycle budget for the host controller. For a 16-bit parallel bus running at typical microcontroller wait-state configurations, this means the flash can keep up with a 50 MHz to 66 MHz core clock with one or two wait states inserted. If your design is migrating from an older 90 ns or 70 ns NOR flash, the 120 ns part may require an extra wait state in the memory controller — check the controller's programmable timing before committing the BOM.

1.65 V supply and industrial temperature range

The PBGA-64 package keeps the footprint compact for space-constrained PCBs, though the BGA requires controlled reflow profiling and X-ray inspection for void-free solder joints.

Procurement can qualify this part into the BOM without an obsolescence watch for the foreseeable future.

Frequently asked questions

Is S70GL02GS12FHIV20 obsolete or end-of-life?

No.